{"product_id":"2338495-3-te-osfp-cage-ganged-1-x-4-connector-press-fit-through-hole","title":"2338495-3 TE OSFP Cage Ganged (1 x 4) Connector Press-Fit Through Hole","description":"\u003cdiv class=\"checklist-box\"\u003e\n\u003cdiv class=\"checklist-box\"\u003e\n\u003ch3\u003eTE Connectivity 2338495-3 Compatible 1x4 OSFP Cage Technical Overview\u003c\/h3\u003e\n\u003cp\u003eThe\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eTE Connectivity 2338495-3\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eis an industry-standard\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003e1x4 ganged OSFP 4-port cage assembly featuring a lightpipe-free low-profile footprint\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eengineered for TE Connectivity 2338495-3 compatible applications in 400G and 800G high-speed pluggable optical networking platforms. Featuring solderless press-fit PCB mounting and 360-degree metallic EMI spring gaskets, it provides high mechanical retention, low transfer impedance panel grounding, and unobstructed thermal airflow clearance for next-generation AI\/HPC clusters, hyperscale data center switches, and telecom infrastructure.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eMechanical Form Factor:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003e1x4 Ganged Single-Row 4-Port OSFP (Octal Small Form-factor Pluggable) Cage Assembly in a lightpipe-free low-profile footprint.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSignal Ecosystem Support:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eEngineered for OSFP systems supporting 112Gb\/s PAM4 per lane signaling architectures compliant with OSFP MSA requirements and IEEE 802.3ck specifications (800G aggregate bandwidth per port).\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBoard Mount Technology:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eSolderless Through-Hole Press-Fit connection (Compliant pin structure to avoid additional solder reflow thermal exposure).\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAlternative Sourcing Option:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eFootprint-compatible alternative options are available from LINK-PP to support multi-source procurement strategies and supply chain flexibility.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"product-entity-overview\"\u003e\n\u003ch2\u003eTE Connectivity 2338495-3 OSFP Cage Assembly Product Overview\u003c\/h2\u003e\n\u003cp\u003eTE Connectivity 2338495-3 is a 1x4 ganged OSFP cage assembly featuring a lightpipe-free low profile design, 360-degree metallic EMI shielding springs, and press-fit PCB mounting. Designed for high-density optical transceivers in AI\/HPC fabrics, cloud switching routers, and telecom transport systems, this 4-port ganged assembly provides robust mechanical module retention, low transfer impedance EMI containment, and PCB mounting support for OSFP optical transceiver interfaces including 400G and 800G Ethernet applications.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003ch2\u003eKey Benefits of TE Connectivity 2338495-3 OSFP Cage Assembly\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eUltra-High 1x4 Quad-Port Density (Up to 3.2 Tbps Aggregate Bandwidth):\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eConsolidates four 800G OSFP ports into a single integrated 1x4 housing, maximizing front-panel I\/O throughput in 1RU\/2RU switch chassis.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStreamlined Lightpipe-Free Unobstructed Airflow Envelope:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eFlat top profile eliminates lightpipe optic channels, maximizing vertical clearance for custom riding heatsinks, liquid cooling cold plates, or chassis forced airflow.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh-Speed Optical Interface Integration:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eSupports next-generation OSFP optical transceivers, Active Optical Cables (AOCs), and Direct Attach Copper (DAC) interconnects used in 400G and 800G networking platforms.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdvanced EMI Containment for 112G PAM4:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eHeavy-duty metallic cage construction and perimeter EMI spring gasket contacts help minimize electromagnetic leakage around pluggable interfaces at high Nyquist frequencies (28 GHz).\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSolderless Press-Fit Manufacturing Flexibility:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003ePrecision compliant press-fit pins simplify board assembly, increase manufacturing yields, and avoid additional solder reflow thermal exposure on multi-layer PCB substrates.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMulti-Source Availability:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eIndustry-standard footprint allows deployment alongside compatible replacement alternatives from qualified suppliers like LINK-PP for BOM cost optimization.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003e1x4 OSFP Cage Architecture \u0026amp; 400G\/800G MSA Compliance\u003c\/h2\u003e\n\u003cp\u003eDesigned around\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003eOSFP MSA mechanical requirements (Rev 4.0\/5.0)\u003c\/strong\u003e, the TE Connectivity 2338495-3 is a 1x4 ganged (four side-by-side ports) OSFP cage assembly. It serves as the physical chassis foundation required to house high-speed 400G (8x50G PAM4) and 800G (8x100G PAM4) optical transceivers, AOCs, and DAC interconnects on high-density line cards.\u003c\/p\u003e\n\u003ch3\u003eQuad-Port Ganged Architecture \u0026amp; Signal Integrity Optimization\u003c\/h3\u003e\n\u003cp\u003eThe ganged 1x4 port matrix layout provides system hardware designers with an optimal balance between port density and PCB trace routing budget. Consolidating four ports into a single housing establishes precise port-to-port pitch across the chassis front bezel, simplifies high-speed 100Ω differential pair routing, minimizes channel insertion loss variability to surface-mount (SMT) OSFP electrical connectors, and prevents trace congestion on ultra-dense line cards.\u003c\/p\u003e\n\u003ch2\u003eEMI Shielded OSFP Cage Design for High-Speed 112G PAM4 Applications\u003c\/h2\u003e\n\u003cp\u003eHigh-speed OSFP interfaces supporting 112Gb\/s PAM4 per-lane signaling require careful electromagnetic compatibility (EMC) design and mechanical shielding to control radiated emissions and signal integrity risks.\u003c\/p\u003e\n\u003ch3\u003e360-Degree Active Metallic EMI Spring Gaskets\u003c\/h3\u003e\n\u003cp\u003eThe TE Connectivity 2338495-3 features heavy-duty, highly resilient metallic EMI gasket springs fitted around the entire outer perimeter of all four module port openings. When integrated into the chassis front panel cutout, these springs compress firmly against the metallic bezel, establishing a continuous, low-impedance grounding interface around the module openings to improve EMI containment performance.\u003c\/p\u003e\n\u003ch3\u003eHigh-Frequency Shielding Structure\u003c\/h3\u003e\n\u003cp\u003eConstructed from a high-conductivity copper alloy with nickel plating, the solid metallic housing functions as an effective EMI shielding structure. It contains internal high-frequency noise generated by optoelectronic components while shielding board-level differential traces from external electromagnetic fields, supporting system-level EMC design requirements for equipment targeting FCC and CE regulatory environments.\u003c\/p\u003e\n\u003ch2\u003ePress-Fit OSFP Cage Features and PCB Assembly Integration\u003c\/h2\u003e\n\u003cp\u003eTo support automated, high-yield manufacturing on dense motherboard layouts, the 2338495-3 is engineered with precision mechanical press-fit pins that interface directly with standard PCB plated through-holes.\u003c\/p\u003e\n\u003ch3\u003eSolderless Compliant Pin Press-Fit Integration\u003c\/h3\u003e\n\u003cp\u003eEquipped with precision compliant press-fit pins, the cage mounts onto the host PCB via mechanical insertion into plated through-holes (PTH). This Through-Hole Technology (THT) avoids additional solder reflow exposure on the PCB substrate, reduces exposure to solder-related thermal stress, and simplifies board repairability.\u003c\/p\u003e\n\u003ch2\u003eThermal Management and Operating Temperature Reliability\u003c\/h2\u003e\n\u003cp\u003eBuilt to endure demanding environmental conditions, the 2338495-3 retains structural integrity and pin contact normal force across an extended operating temperature range of\u003cspan\u003e \u003c\/span\u003e\u003cstrong\u003e-55°C to +85°C [-67°F to +185°F]\u003c\/strong\u003e. Its low-profile lightpipe-free profile maximizes vertical clearance above the cage, accommodating customized riding heatsinks, heat pipes, or direct-to-chip liquid cooling cold plates necessary for managing high-wattage 800G optical modules (up to 14W–20W per port).\u003c\/p\u003e\n\u003ch2\u003eTarget Applications: AI Data Centers, Hyperscale Fabrics and Telecom Networks\u003c\/h2\u003e\n\u003cp\u003eCombining OSFP MSA mechanical compliance, EMI shielding effectiveness, lightpipe-free thermal clearance, and press-fit mounting, the TE Connectivity 2338495-3 supports mission-critical deployments across advanced networking architectures:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eAI \/ GPU Compute Networks:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eUsed in AI\/HPC supercomputing platforms (e.g., NVIDIA Quantum\/Spectrum fabrics, GPU clusters) requiring high-density 800G OSFP interfaces with unobstructed cooling clearance.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHyperscale 400G\/800G Data Center Fabrics:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eOptimized for Top-of-Rack (ToR) switches, spine routers, and optical switching fabrics demanding continuous transceiver insertion durability.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCarrier-Grade Telecom Infrastructure:\u003c\/strong\u003e\u003cspan\u003e \u003c\/span\u003eSuitable for deployment in 5G mobile backhaul aggregation routers, Optical Transport Networks (OTN), and unconditioned edge compute enclosures.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003ch2\u003eTechnical Specifications\u003c\/h2\u003e\n\u003cstyle\u003e\n.ftable_0114f109 { width:100%; border-collapse:collapse; margin:15px 0; font-size:13px; table-layout:fixed; word-wrap:break-word; overflow-wrap:break-word; }\n.ftable_0114f109 th { background-color:#2c3e50; color:#ffffff; padding:10px 8px; border:1px solid #ddd; text-align:left; font-weight:bold; font-size:12px; word-wrap:break-word; }\n.ftable_0114f109 td { padding:8px; border:1px solid #ddd; word-wrap:break-word; font-size:13px; }\n.ftable_0114f109 tr:nth-child(odd) { background-color:#f5f5f5; }\n.ftable_0114f109 tr:nth-child(even) { background-color:#ffffff; }\n\u003c\/style\u003e\n\u003cdiv class=\"phoneTable\"\u003e\n\u003ctable class=\"ftable_0114f109\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cb\u003ePart Number:\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003e2338495-3\u003c\/td\u003e\n\u003ctd\u003e\u003cb\u003ePart Status\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003eActive\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cb\u003eConnector Style\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003eCage, Ganged (1 x 4)\u003c\/td\u003e\n\u003ctd\u003e\u003cb\u003eConnector Type\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003eOSFP\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cb\u003eData Rate (Max)(Gb\/s)\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003e-\u003c\/td\u003e\n\u003ctd\u003e\u003cb\u003eMounting Type\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003eThrough Hole, Right Angle\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cb\u003eTermination\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003ePress-Fit\u003c\/td\u003e\n\u003ctd\u003e\u003cb\u003eFeatures\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003eEMI Shielded\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cb\u003ePort Matrix Configuration\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003e1x4 Ports\u003c\/td\u003e\n\u003ctd\u003e\u003cb\u003eNumber of Ports\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003e4\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cb\u003eNumber of Rear EONs per Port Column\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003e-\u003c\/td\u003e\n\u003ctd\u003e\u003cb\u003eConnector Mounting Type\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003eBoard Mount\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cb\u003eOperating Temperature Range\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003e-55 – 85°C\u003c\/td\u003e\n\u003ctd\u003e\u003cb\u003ePluggable I\/O Applications\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003eSFP+ Stacked Belly-to-Belly\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cb\u003eCircuit Application\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003eSignal\u003c\/td\u003e\n\u003ctd\u003e\u003cb\u003eEMI Containment Feature Type\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003eExternal Springs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cb\u003eIncluded Lightpipe\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003eNo\u003c\/td\u003e\n\u003ctd\u003e\u003cb\u003eCage Material\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003e-\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cb\u003ePCB Thickness (Recommended)\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003e-\u003c\/td\u003e\n\u003ctd\u003e\u003cb\u003eTail Length\u003c\/b\u003e\u003c\/td\u003e\n\u003ctd\u003e-\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"text-align: left;\" dir=\"ltr\" align=\"center\"\u003e\n\u003cdiv dir=\"ltr\" align=\"center\"\u003e\n\u003cdiv style=\"text-align: -webkit-center;\" dir=\"ltr\" align=\"center\"\u003e\n\u003cp style=\"text-align: left;\"\u003e\u003cstrong\u003eContact us.\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp style=\"text-align: left;\"\u003e\u003cspan\u003eFor any inquiries, please feel free to contact us. We reply within 24 hours. \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"text-align: left;\"\u003e\u003cspan\u003e📧 Email: una@f-tone.com \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"text-align: left;\"\u003e\u003cspan\u003e📱 Mobile \/ WhatsApp \/ WeChat: +86 177 6116 3895\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"text-align: left;\"\u003eImportant Notice\u003c\/p\u003e\n\u003cp style=\"text-align: left;\"\u003ePerformance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by F-tone Networks before they become applicable to any particular order or contract. In accordance with the F-tone Networks policy of continuous improvement specifications may change without notice.\u003c\/p\u003e\n\u003cp style=\"text-align: left;\"\u003eThe publication of information in this data sheet does not imply freedom from patent or other protective rights of F-tone Networks or others. Further details are available from any F-tone Networks sales representative.\u003cbr\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"F-tone Networks","offers":[{"title":"Default Title","offer_id":47712090783881,"sku":null,"price":0.0,"currency_code":"CNY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0665\/8011\/9689\/files\/2338495-3TEOSFPCageGanged_1x4_ConnectorPress-FitThroughHole-1.jpg?v=1785478539","url":"https:\/\/www.fibersoon.com\/products\/2338495-3-te-osfp-cage-ganged-1-x-4-connector-press-fit-through-hole","provider":"F-tone Networks","version":"1.0","type":"link"}