
F-tone’s High Density PM Fiber Jumper series delivers exceptional polarization stability for High-Speed coherent optics and AI clusters. As bandwidth scales beyond 800G, our jumpers ensure high PER, low insertion loss, and robust reliability in Space-Constrained modules. With precision alignment and stringent process control, Vlink provides the critical interconnect for silicon photonics and Next-Gen optical systems
| Key Features | Applications |
| High Polarization Extinction Ratio (PER) | CPO (Co-Packaged Optics) |
| Ultra-Precise Core Pitch Control | AI/ML Clusters & GPU-to-GPU Interconnects |
| Low Insertion Loss & High Return Loss | Silicon Photonics (SiPh) Chip-level Packaging |
| Specialty Fiber Integration | High-Performance Computing (HPC) Architectures |
| High-Density & Low-Profile Design | 7. Coherent Optical Transceivers (400G/800G) |
| Robust Reliability |
| Parameter | Unit | Value |
| Wavelength | nm | 1310 |
| Fiber Count | — | 8 ch, 16 ch, 32 ch, 40 ch, 80 ch + (Customizable) |
| Max. Connector Insertion Loss | dB | 0.5 |
| Max. Coupling Insertion Loss | dB | 1 |
| Min. Return Loss | dB | 30 |
| Min. PER | dB | 20 |
| Fiber Pitch Spacing | μm | 84 μm, 127 μm, 250 μm (Customizable) |
| Max. Core Pitch Error | μm | ± 0.7 |
| Fiber Type | — | SM (G.657.A1/A2), PM Fiber, RCBI (Reduced-Clad) |
| Termination Connector Type | — | LC, FC, MPO, MMC, ELSFP Connector (Customizable) |
| Operating Temperature | °C | - 40 °C to + 85 °C |
| Key Features | Applications |
| High-precision fiber core alignment for edge-coupled photonic chips | Silicon photonics edge coupling |
| Customizable fiber pitch: 127 μm/250 μm/Customer-Specific (1D or 2D) | Thin-Film lithium niobate modulator coupling |
| Supports SMF, PM fiber, polarization-maintaining fiber arrays, and specialty fibers | Coherent optical modules |
| Optional angled polish for back-reflection reduction | 800G/1.6T optical transceivers |
| Compatible with SiPh, TFLN, InP, PLC, glass, and other photonic platforms | CPO/optical I/O packaging |
| Custom mechanical outline for active/passive alignment and automated assembly | Optical engine assembly |
| Available with lid glass, V-groove substrate, spacer, stopper, and customized bonding area | LiDAR optical modules |
| Suitable for High-Density optical I/O and advanced photonic packaging | Fiber sensing and test systemsMedical and scientific photonic systems |
This product belongs to F-tone Networks' optical components product line. For detailed specifications, please contact our sales team. Thank you!
Important Notice:
Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by F-tone Networks before they become applicable to any particular order or contract. In accordance with the F-tone Networks policy of continuous improvement specifications may change without notice.
The publication of information in this data sheet does not imply freedom from patent or other protective rights of F-tone Networks or others. Further details are available from any F-tone Networks sales representative.
