1367645-5 SFP Cage with Heat Sink Connector Press-Fit Through Hole

DWDM, SFP, Cage Assembly, Data Rate (Max) 4 Gb/s, External Springs, SFP, 1 x 1, Pin, Heat Sink Height 6.5 mm [.256 in]

The 1367645-6 is an industrial-grade 1x1 SFP Cage Assembly with an Integrated Heat Sink, engineered to manage the aggressive thermal loads of specialized pluggable I/O optics. Rated for data rates up to 4 Gb/s, this receptacle provides the critical structural and thermal infrastructure required for legacy 4G Fibre Channel Storage Area Networks (SAN) and high-power telecommunications transport equipment.

The defining architectural feature of the 1367645-6 is its thermal management system, specifically tailored for hot-running DWDM (Dense Wavelength Division Multiplexing) transceivers. Because DWDM lasers dissipate significantly more heat than standard short-reach optics, the cage is equipped with a specialized Pin-Style Heat Sink. Unlike traditional longitudinal fins, the pin-grid geometry allows for omnidirectional thermal dissipation, making it highly effective in complex chassis environments with turbulent or cross-directional air currents. Notably, this model utilizes a 6.5mm (0.256 inch) Networking-class height profile. Compared to shorter PCI-class alternatives, this taller profile provides increased thermal mass and surface area, making it the preferred architecture for 1RU and 2RU carrier-grade switches where Z-axis clearance is slightly more forgiving, but aggressive heat shedding is absolutely mandatory.

Mechanically, the Copper Alloy cage is equipped with heavy-duty External EMI Springs. In mixed-vendor deployments where sheet metal faceplates exhibit unpredictable stamping tolerances, these springs actively compress against the chassis bezel. This establishes continuous 360-degree grounding, containing high-frequency RF leakage and ensuring strict FCC/CE electromagnetic compliance.

Designed for high-yield manufacturing on heavy-duty motherboards, it utilizes a solderless Through-Hole Press-Fit termination. With an extended 3.0mm tail length, it is explicitly optimized for thicker, high-layer-count PCBs (recommended 2.25mm thickness). By eliminating wave soldering, the press-fit architecture preserves the plating integrity and impedance of adjacent high-speed signal vias. Operating reliably from -55°C to +85°C, it is the definitive SFP housing for ruggedized telecom base stations, DWDM transport nodes, and extreme-environment routing platforms.