1658390-2 2x4 Port 160 P SFP Cage Assembly PRESS FIT EMI Springs Through Hole

1658390-2 2x4 SFP Stacked Receptacle and Cage Assembly

Engineered to maximize faceplate I/O density in demanding data center architectures and telecommunications equipment, the 1658390-2 is a highly integrated 2x4 (8-port) stacked SFP cage assembly. By organizing eight Small Form-factor Pluggable (SFP) ports into a dense, vertically stacked 2x4 matrix, this assembly allows hardware architects to drastically increase port capacity on standard 1U and 2U networking chassis. Crucially, it features an integrated electrical receptacle with 160 positions (20 pins per port), combining both the mechanical EMI shielding cage and the internal connectors into a single, pre-aligned unit capable of supporting data transmission rates up to 16 Gb/s per channel.

Built to endure severe environmental extremes, this heavy-duty cage assembly delivers robust mechanical durability across a military-grade temperature range of -55°C to 85°C. Utilizing an optimized Through-Hole mounting design with integrated board guides, the 1658390-2 guarantees mission-critical reliability for climate-controlled enterprise data centers, ruggedized military hardware, and unconditioned outdoor edge computing enclosures.

Integrated 2x4 Stacked Architecture & Receptacles

The ganged 2x4 port matrix is a foundational mechanical configuration for high-capacity aggregation routers and core edge switches.

• Pre-Aligned Electrical Interface: Unlike standalone cages that require discrete surface-mount SFP connectors, the 1658390-2 integrates the electrical receptacles directly into the assembly. This eliminates planar tolerance stack-up issues during printed circuit board (PCB) assembly and ensures flawless transceiver mating.
• Streamlined Front Panel (No Lightpipes): Designed explicitly without integrated lightpipes, this cage offers a clean, unobstructed outer profile. This reduces internal trace routing complexity for applications utilizing external, chassis-mounted diagnostic LEDs or custom faceplate bezels.
• 160-Position Density: Provides full support for all 8 ports with 20 contacts per port, maintaining optimal signal integrity and power delivery for high-speed optics and DAC cables.

Advanced EMI Containment via EMI Springs

Managing Electromagnetic Interference (EMI) in high-density, multi-port chassis configurations operating at 16 Gb/s is a critical design mandate. The 1658390-2 achieves superior electromagnetic compatibility (EMC) through its advanced shielding construction.

• Active EMI Springs: Heavy-duty metallic EMI springs surround the perimeter of the port openings. These external springs compress directly against the inner edge of the metallic chassis bezel, creating a continuous 360-degree, low-impedance electrical path to ground, sealing the enclosure against external Radio Frequency Interference (RFI).
• High-Frequency Shielding: The robust metallic cage acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions generated by the PHY transceivers and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.
• Port-to-Port Isolation: Internal metallic dividers between the stacked and adjacent ports act as physical and electrical barriers, dramatically reducing near-end crosstalk (NEXT) and electromagnetic coupling across the 8-port matrix.

Mechanical Design & PCB Integration

Hardware engineers prioritize long-term mechanical reliability alongside high-throughput manufacturing. The 1658390-2 leverages advanced alignment and mounting technology to optimize the PCB assembly workflow.

• Press-Fit & Solder Integration: Utilizing a hybrid Through-Hole methodology, the mechanical cage pins allow for Press-Fit structural retention, while the electrical contacts are engineered for highly reliable wave soldering. This ensures a gas-tight mechanical bond that heavily resists vibration.
• Integrated Board Guides: Features precision board guides (alignment posts) that secure the component to the PCB prior to soldering, preventing structural skew during automated assembly and ensuring perfectly seated, low-impedance joints.

Typical Applications

Combining massive 8-port stacked density, integrated electrical receptacles, a resilient mounting design, and extreme thermal tolerance (-55°C to 85°C), the 1658390-2 is the optimal interconnect housing for demanding network architectures:

• Data Center & Enterprise Switching: High-density Gigabit Ethernet edge switches, Top-of-Rack (ToR) routers, and core network aggregation devices demanding visually clean, 16 Gb/s capable port matrices.
• Storage Area Networks (SAN): 16G Fibre Channel storage arrays and high-throughput Host Bus Adapters (HBAs) requiring dense physical layer protection.
• Telecommunications Infrastructure: Broadband access hubs, unconditioned outdoor 5G baseband units (BBUs), and fiber-to-the-x (FTTX) optical line terminals.
• Defense & Aerospace: Ruggedized military communication hubs and avionics systems subjected to massive temperature fluctuations and intense mechanical vibration.