1658391-2 40 (20 x 2) Position SFP Receptacle with Cage Ganged (2x1) Connector Solder

TE 1658391-2 2x1 SFP Stacked Receptacle and Cage Assembly

Engineered to maximize faceplate I/O density and streamline PCB assembly, the TE1658391-2 is a highly integrated 2x1 (stacked) SFP cage and receptacle assembly. Unlike standalone cages that require a separately soldered SFP connector, this comprehensive module integrates both the mechanical shielding cage and the 40-position (20 pins per port) electrical receptacle into a single right-angle unit. Supporting data transmission rates up to 4 Gb/s per channel, it allows hardware architects to double the port density of standard 1U/2U networking chassis without sacrificing signal integrity.

Built to endure the most demanding operational environments, this assembly delivers robust mechanical durability across an extreme extended temperature range of -55°C to 105°C. Utilizing a highly reliable Through-Hole Solder mounting mechanism augmented by integrated board guides, the 1658391-2 ensures exact PCB alignment and a permanent mechanical bond capable of withstanding heavy vibration and physical shock.

Integrated 2x1 Stacked Architecture & Receptacle

The ganged 2x1 port matrix is an essential configuration for high-capacity aggregation routers, edge switches, and telecommunications equipment.

• Integrated Electrical Interface: Features a built-in 40-position (20x2) SFP electrical receptacle. This pre-aligned integration eliminates the tolerance stack-up issues commonly associated with placing discrete connectors and cages, ensuring flawless transceiver insertion.
• Vertical Space Optimization: Stacking two SFP ports vertically optimizes printed circuit board (PCB) real estate, enabling 48-port or higher density configurations on a standard rack-mount logic board.
• Through-Hole Soldering & Board Guides: Designed for robust wave soldering processes, the assembly includes precise board guides (alignment posts) that secure the component to the PCB prior to soldering, preventing skew and ensuring low-impedance solder joints.

Advanced EMI Containment & Shielding

Managing Electromagnetic Interference (EMI) in high-density, multi-port chassis configurations is a critical design mandate. The 1658391-2 achieves superior electromagnetic compatibility (EMC) through its fully shielded envelope.

• Multi-Point EMI Springs: Heavy-duty metallic EMI springs surround the front perimeter of both the upper and lower port openings. These springs ensure continuous, low-impedance electrical contact with the metallic chassis bezel, aggressively sealing the enclosure against external Radio Frequency Interference (RFI).
• High-Frequency Containment: The robust metallic cage structure acts as a continuous Faraday shield, containing internal high-frequency emissions generated by the PHY transceivers to ensure strict compliance with FCC, CE, and CISPR regulatory standards.
• Port-to-Port Isolation: The internal divider isolating the top and bottom receptacles acts as a physical and electrical barrier, virtually eliminating near-end crosstalk (NEXT) between the stacked SFP modules.

Hardware Layout & Extreme Thermal Resilience

For hardware engineers designing mission-critical systems, thermal endurance is paramount. The 1658391-2 boasts an extraordinary -55°C to 105°C operating range, making it virtually immune to the thermal degradation commonly found in poorly ventilated edge computing enclosures or ruggedized military hardware. When routing the PCB, designers must ensure the high-speed differential pairs for all 40 positions are meticulously length-matched to preserve the 4 Gb/s signal fidelity.

Typical Applications

Combining extreme temperature resilience, integrated electrical contacts, and a high-density stacked footprint, the 1658391-2 is the optimal choice for rugged, high-bandwidth networking infrastructure:

• Defense & Aerospace: Ruggedized military communication hubs and avionics systems subjected to massive temperature fluctuations and intense vibration.
• Industrial Automation: Hardened Industrial Ethernet switches deployed in extreme manufacturing, outside plant (OSP), and energy sector environments.
• Telecommunications Infrastructure: Broadband aggregation routers, Central Office (CO) switches, and unconditioned outdoor 5G cellular base stations.
• Data Center Networking: High-density Gigabit Ethernet edge switches and core network aggregation devices demanding stacked port matrices.