1658744-3 SFP 1X4 CAGE Assembly 4 Gbs EMI Springs Through Hole Press-Fit Mount

1658744-3: 1x4 SFP Ganged Cage Assembly with EMI Springs (4 Gb/s, Press-Fit)

Engineered for high-density network switching and telecommunications equipment, the 1658744-3 is a highly robust 1x4 (4-port) ganged SFP cage assembly. Designed specifically to house Small Form-factor Pluggable (SFP) optical and copper transceivers, this cable-to-board interconnect solution reliably supports data rates up to 4 Gb/s. By consolidating four ports into a single integrated housing, it enables data center architects and hardware designers to maximize front-panel I/O density without compromising chassis airflow or signal integrity.

Built to withstand extreme operational conditions, this assembly features a broad industrial operating temperature range of -55°C to 85°C. It utilizes a solderless Through Hole Press-Fit mounting mechanism, providing a highly secure mechanical bond to the printed circuit board (PCB) while streamlining high-volume manufacturing processes.

High-Density Ganged Architecture & Performance

The 1x4 port matrix configuration significantly reduces the overall PCB footprint compared to using four individual single-port cages. This ganged architecture maintains strict mechanical tolerances for multi-port transceiver insertion and extraction. Rated for 4 Gb/s data rates, the 1658744-3 is an ideal physical layer housing for standard Gigabit Ethernet (1GbE), 2.5GbE, and up to 4G Fibre Channel (4GFC) SAN networking applications.

Advanced EMI Containment & Shielding

Electromagnetic compatibility (EMC) is critical in high-density networking hardware. Instead of standard elastomeric gaskets, the 1658744-3 employs robust metallic EMI springs.

• Multi-Point Grounding: The EMI springs provide continuous, multi-point electrical contact between the SFP cage and the chassis bezel or faceplate.
• High-Frequency Shielding: Aggressively contains Electromagnetic Interference (EMI) and Radio Frequency Interference (RFI) emissions from high-frequency PHY transceivers, ensuring compliance with strict FCC and CE regulatory standards.
• Port-to-Port Isolation: The internal walls of the ganged cage act as Faraday cages, minimizing crosstalk between adjacent SFP modules.

Mechanical Design & Press-Fit PCB Integration

Hardware engineers must account for thermal stress and mechanical reliability during PCB assembly. The 1658744-3 addresses this through its precise mounting design.

• Press-Fit Technology: Features compliant pins that press directly into plated through-holes on the PCB. This solderless application eliminates the thermal stress associated with wave or reflow soldering, preventing PCB warping and ensuring long-term mechanical stability.
• Cable-to-Board Interface: Acts as the rugged mechanical guide for the SFP transceivers, aligning them perfectly with the surface-mount SFP electrical connectors underneath.
• Harsh Environment Ready: Rated for an extraordinary -55°C to 85°C, making this cage assembly suitable for aerospace, military, outside plant (OSP) telecom cabinets, and unconditioned edge data center environments.

Typical Applications

Combining multi-port density, rapid press-fit assembly, and military-grade temperature tolerances, the 1658744-3 SFP cage is perfectly suited for mission-critical networking infrastructure:

• Telecommunications: Central office switches, broadband aggregation routers, and fiber-to-the-home (FTTH) Optical Line Terminals (OLTs).
• Storage Area Networks (SAN): 4G Fibre Channel switches and enterprise storage arrays.
• Industrial Networking: Hardened Industrial Ethernet switches deployed in extreme climates or factory floors.
• Edge Computing: High-density I/O panels in modular or unconditioned micro-data centers.