1658859-2 SFP Cage Assembly 2 x 1 Port with Integrated Connector 4 Gbs

LINK-PP 2x1 SFP Cage with Integrated Connector | TE 1658859-2 Replacement

The LINK-PP 2x1 SFP Cage Assembly is a highly advanced, dual-port structural and electrical housing engineered for high-density optical networking. Uniquely combining a 40-position (20x2) integrated receptacle with a robust metal cage, this Ganged (2x1) module supports data rates up to 4 Gb/s. Featuring built-in Integrated Lightpipes, it allows hardware designers to easily route motherboard LED status signals directly to the front faceplate, creating a seamless and aesthetically clean I/O panel for complex telecommunication systems.

TE Connectivity 1658859-2 Compatible Solution

This precision-engineered assembly serves as a direct, drop-in alternative for hardware applications originally designed around the TE 1658859-2 SFP receptacle with cage. Delivering an identical mechanical footprint, equivalent 4Gb/s signal integrity, and matching Board Guide features, it enables OEM manufacturers to confidently execute BOM (Bill of Materials) optimizations without altering the host PCB layout or faceplate design.

Engineered for Extreme Thermal Environments (-55°C to +105°C)

Surpassing standard industrial thermal specifications, this SFP assembly boasts a staggering operating temperature range of -55°C to +105°C. This exceptional resilience ensures absolute mechanical and electrical stability in the most demanding environments, from sub-zero arctic deployments to heavily enclosed, high-heat electronics. Typical applications include aerospace communication arrays, military-grade ruggedized servers, harsh-environment industrial switches, and outdoor 5G telecom base stations.

Technical Specifications & Structural Features

• Hybrid PCB Mounting: Utilizes a highly reliable hybrid design where the internal high-speed connector features precision Through-Hole Solder pins, while the external shielding cage employs Press-Fit (compliant pin) technology for robust mechanical retention.
• Integrated Lightpipes: Pre-installed dual lightpipes per port eliminate the need for discrete optical routing components, significantly simplifying front-panel design and assembly.
• Premium EMI Shielding: Built with high-grade shielding materials and equipped with heavy-duty EMI Springs around the bezel opening, guaranteeing superior RF containment and strict FCC/CE emission compliance.
• High-Density 2x1 Port Matrix: Consolidates two SFP ports into a single continuous housing, maximizing horizontal board space while providing secure Board Guide alignment for flawless PCB insertion.
• Extreme Durability: Engineered to withstand massive thermal stress (up to 105°C), ensuring zero structural deformation or signal loss in life-critical and mission-critical hardware.