1761014-3 SFP 1x2 Ganged Cage Assembly | 4 Gb/s Press-Fit EMI Receptacle
The 1761014-3 is a highly reliable 1x2 (Dual-Port) Ganged SFP Cage Assembly engineered for Gigabit Ethernet and 4G Fibre Channel applications. Designed to house standard Small Form-factor Pluggable (SFP) transceivers and Direct Attach Copper (DAC) cables, this shielded receptacle supports stable data rates up to 4 Gb/s per port. Featuring robust EMI spring fingers and a solderless press-fit termination, it provides critical mechanical stability and electromagnetic containment for high-density networking and telecom infrastructure.
Manufactured under stringent quality control protocols, the 1761014-3 assembly ensures perfect mechanical mating, extraction force compliance, and superior grounding. The component is subjected to rigorous dimensional and EMI shielding effectiveness tests. It maintains full compliance with the SFP Multi-Source Agreement (MSA) and global environmental certifications, including RoHS and REACH, guaranteeing long-term durability in both enterprise data centers and extreme edge computing environments.
Expert Architecture Insight: SFP Form Factor vs. Data Rate
Engineering Notice: While this component shares the exact physical envelope of the broader SFP/SFP+/zSFP+ product family, this specific cage is optimized and rated for a maximum throughput of 4 Gb/s. It is the ideal hardware housing for standard 1.25G Gigabit Ethernet (1000BASE-X), SONET/SDH, and 4G Fibre Channel Storage Area Networks (SAN). Using this cage for legacy or sub-5G architectures offers a highly cost-effective, perfectly shielded solution without over-specifying to more expensive 28G zSFP+ hardware.
High-Density 1x2 Integration & Press-Fit Assembly
Operating flawlessly across an extreme temperature range of -55°C to +85°C, this dual-port SFP cage is built to streamline PCB manufacturing and maximize faceplate density:
- Solderless Press-Fit Termination: Features resilient "Eye-of-the-Needle" compliant pins designed for Through-Hole Press-Fit mounting. This eliminates the need for wave soldering, mitigating thermal stress on complex, multi-layer motherboards and speeding up automated assembly lines.
- 1x2 Ganged Configuration: Integrates two SFP ports into a single continuous metal housing. This "ganged" design reduces component placement time, ensures perfect port-to-port coplanarity, and saves critical horizontal PCB real estate compared to utilizing two separate 1x1 cages.
- Exceptional EMI Shielding: Equipped with robust external EMI springs that create a continuous 360-degree conductive ground path to the equipment bezel. This effectively contains high-frequency RF noise and prevents electromagnetic interference in densely packed racks.
- Unibody Metal Construction: Fabricated to withstand high insertion/extraction cycles, ensuring mechanical rigidity during the repeated hot-swapping of optical transceivers.
Typical Applications & Industry Use Cases
Due to its rugged press-fit design, dual-port density, and 4 Gb/s capability, the 1761014-3 is the preferred housing for:
- Storage Area Networks (SAN): 4G Fibre Channel host bus adapters (HBA) and clustered storage arrays.
- Telecom Infrastructure: Baseband units, optical transport networks (OTN), and outdoor edge routers exposed to extreme temperatures (-55°C to +85°C).
- Enterprise Networking: 1x2 SFP uplink ports on Gigabit Ethernet switches and hardware firewalls.
- Industrial Communication: Ruggedized industrial PCs (IPC) and media converters requiring highly reliable, pluggable optical I/O.
Product Specifications
| Part Number | 1761014-3 | Connector Type | SFP (Small Form-factor Pluggable) |
| Part Status | Active | Connector Style | Cage Assembly, Ganged (1x2) |
| Port Matrix Configuration | 1x2 Ports (Dual Port) | Data Rate (Max per port) | 4 Gb/s |
| Termination Method | Through Hole - Press-Fit | Connector Mounting Type | Board Mount |
| EMI Containment Feature | EMI Springs | Connector System | Cable-to-Board |
| Operating Temp Range | -55℃ TO +85℃ | Pluggable I/O Application | SFP (MSA Compliant) |
| Circuit Application | Signal | Included Lightpipe | No |
| Sealable | No | Contact Terminates To | Printed Circuit Board (PCB) |
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Important Notice
Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by F-tone Networks before they become applicable to any particular order or contract. In accordance with the F-tone Networks policy of continuous improvement specifications may change without notice.
The publication of information in this data sheet does not imply freedom from patent or other protective rights of F-tone Networks or others. Further details are available from any F-tone Networks sales representative.
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Power and Wavelength Testing
Test the signal delivering strength and wavelength, to ensure the signal decoding capacity of the receiver, and the wavelength remains consistent from the transmitter to the receiver.
Traffic Testing
Test the bit error rate and packet loss rate, to make them meet the corresponding standards and ensure the performance of transceivers.
Optical Performance Testing
Test the transceivers' eye diagram situation, receiving sensitivity, extinction ratio, wavelength, light-emitting, light-receiving, current and voltage, to ensure the signal quality, stability and reliability of the transmission.
End Face Testing
Check the end face of the transceivers and keep them clean for more stable data transmission, better performance, and durability.
Various Switch Tests
Every module is quality tested for compatibility in the multi-brand switches environment, guaranteeing flawless operations.