1761015-3 SFP Cage 1X6 Port 4 Gbs Through Hole Press-Fit Right Angle

TE 1761015-3 1x6 SFP Ganged Cage Assembly

Engineered to maximize faceplate I/O density in enterprise switching and telecommunications hardware, the TE 1761015-3 is a ruggedized 1x6 (6-port) ganged SFP cage assembly. Designed as a seamless cable-to-board interconnect solution, this housing accommodates Small Form-factor Pluggable (SFP) optical transceivers and direct-attach copper (DAC) cables, reliably supporting data transmission rates up to 4 Gb/s per channel. By consolidating six physical ports into a single, highly aligned mechanical structure, hardware architects can drastically optimize printed circuit board (PCB) real estate while streamlining high-speed network routing.

Built to endure severe environmental extremes, this cage assembly delivers robust mechanical durability across a military-grade temperature range of -55°C to 85°C. Utilizing a reliable solderless Through Hole Press-Fit mounting mechanism, the 1761015-3 ensures a permanent, highly secure mechanical connection to the PCB without subjecting the motherboard to the destructive thermal stress of secondary wave soldering processes.

High-Density 1x6 Ganged Architecture

The ganged 1x6 port matrix is an essential mechanical configuration for high-capacity aggregation routers and high-port-count edge switches. Compared to routing and aligning six independent, single-port cages, the 1761015-3 guarantees perfect port-to-port horizontal alignment, providing unified mechanical rigidity that simplifies high-volume chassis assembly. Rated for 4 Gb/s, it serves as the ideal physical layer housing for standard Gigabit Ethernet (1GbE), robust SONET/SDH telecom links, and up to 4G Fibre Channel (4GFC) Storage Area Network (SAN) topologies.

Advanced EMI Containment & Shielding

Managing Electromagnetic Interference (EMI) at the chassis faceplate is a critical design mandate, especially as port densities scale. The 1761015-3 achieves superior electromagnetic compatibility (EMC) through its integrated shielding mechanisms.

• Multi-Point EMI Springs: Heavy-duty metallic EMI springs surround the front perimeter of the cage opening. These springs ensure continuous, low-impedance electrical contact with the metallic chassis bezel, aggressively sealing the enclosure against external Radio Frequency Interference (RFI).
• High-Frequency Containment: The metallic alloy structure acts as a Faraday shield, containing internal high-frequency emissions generated by the PHY transceivers to ensure strict compliance with FCC, CE, and CISPR regulatory standards.
• Port-to-Port Isolation: The internal divider walls of the 1x6 ganged cage act as physical and electrical barriers, virtually eliminating near-end crosstalk (NEXT) and electromagnetic coupling between adjacent SFP modules.

Mechanical Design & Press-Fit PCB Integration

Hardware engineers prioritize long-term mechanical reliability alongside high-yield manufacturing. The 1761015-3 leverages advanced compliant pin technology to optimize the PCB assembly workflow.

• Press-Fit (Compliant Pin) Technology: Completely eliminates the need for wave soldering. The compliant pins press directly into plated through-holes (PTH) on the PCB, creating a cold-welded, gas-tight electrical and mechanical connection that resists physical vibration and thermal cycling.
• Structural Rigidity: Acts as a rigid mechanical guide rail system, absorbing the physical stress of frequent SFP transceiver insertion and extraction, thereby protecting the delicate SFP surface-mount electrical connectors located beneath the cage.
• Thermal Endurance: The extreme -55°C to 85°C operating range ensures uninterrupted physical protection for optics deployed in unconditioned outdoor enclosures, industrial factory floors, and aerospace applications.

Typical Applications

Offering massive 6-port density, rapid solderless assembly, and extreme temperature resilience, the 1761015-3 SFP cage is the optimal choice for high-bandwidth, ruggedized networking infrastructure:

• Telecommunications Infrastructure: Broadband aggregation routers, Central Office (CO) switches, and outdoor 5G cellular base station equipment.
• Enterprise & Data Center Networking: High-density Gigabit Ethernet (1GbE) switches, edge routing platforms, and core network aggregation devices.
• Storage Area Networks (SAN): 4G Fibre Channel (4GFC) storage area network arrays requiring uncompromised signal integrity and port density.
• Industrial & Edge Computing: Hardened Industrial Ethernet (IE) switches deployed in extreme manufacturing, outside plant (OSP), and harsh energy sector environments.