2007194-1 16 Gb/s SFP+ Cage Assembly 1x1 Port Through Hole Solder

TE 2007194-1 1x1 SFP+ Cage Assembly

Engineered to deliver exceptional signal integrity and permanent mechanical stability in demanding data center and telecommunications infrastructure, the TE 2007194-1 is a premium 1x1 (single-port) SFP+ cage assembly. Designed as a ruggedized cable-to-board mechanical receptacle for high-speed Small Form-factor Pluggable (SFP+) optical transceivers and direct-attach copper (DAC) cables, this shielding cage reliably supports data transmission rates up to 16 Gb/s. Operating as a standalone mechanical housing, it is explicitly designed to envelop discrete surface-mount (SMT) SFP+ electrical connectors, granting hardware architects maximum layout flexibility on the printed circuit board (PCB).

Constructed for extreme environmental endurance, this cage assembly delivers intrinsic resistance to oxidation and robust mechanical durability across a military-grade temperature range of -55°C to 105°C. Utilizing a highly reliable Through Hole Solder mounting mechanism augmented by integrated board guides, the 2007194-1 ensures precise PCB alignment and a permanent, vibration-resistant connection ideal for mission-critical networking hardware.

Single Port Architecture & Board Alignment

The discrete 1x1 port configuration serves as an essential mechanical foundation for modular, high-capacity aggregation routers, edge switches, and specialized telecommunications equipment requiring flexible transceiver placements.

• Integrated Board Guides: Features precision board guides (alignment posts) that securely anchor and align the cage to the PCB prior to wave soldering. This critical feature prevents structural skewing during automated assembly and ensures perfect mechanical alignment with the underlying SMT transceiver connector.
• Streamlined Front Panel (No Lightpipes): Designed explicitly without integrated lightpipes, this cage offers a clean, low-interference outer profile. This is highly advantageous for custom faceplate bezels or systems that rely on external, chassis-mounted diagnostic LEDs, significantly reducing internal trace routing complexity.

Advanced EMI Containment via Active Springs

Managing Electromagnetic Interference (EMI) at 16 Gb/s frequencies is a critical design mandate, especially in densely packed rack environments. The 2007194-1 achieves superior electromagnetic compatibility (EMC) through its advanced shielding construction.

• Active EMI Springs: Heavy-duty metallic EMI springs surround the front perimeter of the cage opening. These springs compress directly against the inner edge of the metallic chassis bezel, creating a continuous 360-degree, low-impedance electrical path to ground, effectively sealing the enclosure against external Radio Frequency Interference (RFI).
• High-Frequency Shielding: The robust metallic structure acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions generated by the PHY transceivers and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.

Mechanical Design & Wave Solder Integration

Hardware engineers prioritize long-term mechanical reliability alongside high-yield automated manufacturing. The 2007194-1 leverages robust Through-Hole Technology (THT) to optimize the PCB assembly workflow.

• Through-Hole Solder Stability: Engineered specifically for standard wave soldering processes, the solid through-hole pins establish a permanent metallurgical bond with the PCB. This heavily resists the mechanical stress, physical shock, and thermal cycling associated with frequent transceiver insertions in harsh environments.
• Extreme Thermal Endurance: The extended -55°C to 105°C operating range ensures uninterrupted physical protection for optics deployed in unconditioned outdoor enclosures, industrial factory floors, and aerospace applications.