2007254-1 Position SFP+ Cage Connector 16 Gb/s Press-Fit Through Hole With Light Pipe

SFP+ Cage, Data Rate (Max) 16 Gb/s, External Springs, Included Lightpipe, 1 x 1, Dual Round, Standard

The 2007254-1 is a high-density, industrial-grade 1x1 SFP+ Cage Assembly engineered to provide robust mechanical housing and critical electromagnetic shielding for pluggable I/O transceivers. Rated for a maximum data rate of 16 Gb/s, this receptacle is fully optimized for both 10G Ethernet (10GbE) and 16G Fibre Channel (16GFC) applications. Designed as an SFP+ Enhanced form factor, it provides the superior structural integrity required for enterprise routing, Storage Area Networks (SAN), and next-generation telecommunications switching platforms.

To ensure pristine signal integrity at 16 Gb/s, the 2007254-1 is constructed from highly durable Nickel Silver and features heavy-duty External EMI Springs. These springs establish continuous, 360-degree electrical grounding against the equipment chassis faceplate, actively absorbing sheet-metal tolerances. This architecture critically contains high-frequency RF leakage, ensuring strict FCC/CE electromagnetic compatibility in mixed-vendor chassis deployments. Furthermore, the assembly integrates a Dual Round Lightpipe. This optical feature allows engineers to route Link and Activity LED indicators from the underlying PCB directly to the front bezel, optimizing front-panel density and eliminating the need for complex, secondary LED mounting hardware.

Mechanically, the cage is tailored for high-yield, solderless manufacturing utilizing a Through-Hole Press-Fit termination. Notably, this model features a 2.05mm tail length calibrated for a thicker, high-layer-count 2.25mm recommended PCB. Because the EON (Eye-of-Needle) pins do not fully breach the bottom layer of the 2.25mm board, this specific dimensional ratio provides layout engineers with critical flexibility to route sensitive signals on the bottom layer without fear of mechanical interference or via stub resonance.

Uniquely, the 2007254-1 boasts an extreme Operating Temperature Range of -55°C to +105°C. This aerospace and industrial-grade thermal resilience guarantees zero mechanical degradation under severe environmental stress, making it the definitive SFP+ housing solution for ruggedized 5G telecom base stations, unconditioned edge computing enclosures, and high-density data centers.