2007464-2 TE SFP+ Cage With Heat Sink 16 Gbs External Springs

TE 2007464-2 1x1 SFP+ Cage Assembly with 6.5mm Pin Heat Sink

Engineered to resolve demanding thermal and signal integrity challenges in next-generation telecommunications and high-density data center infrastructure, the TE 2007464-2 is a premium 1x1 (single-port) SFP+ cage assembly. Designed to house and protect high-speed Small Form-factor Pluggable Plus (SFP+) optical transceivers and direct-attach copper (DAC) cables, this highly durable mechanical receptacle reliably supports data transmission rates up to 16 Gb/s. To aggressively combat the intense localized heat generated by high-frequency 10GbE and 16G Fibre Channel optics, this cage integrates a precision-engineered 6.5mm [0.256 in] pin heat sink, providing superior omnidirectional passive thermal dissipation.

Constructed from a premium Nickel Silver Alloy, this cage assembly delivers intrinsic structural rigidity and outstanding resistance to oxidation across an extreme military-grade temperature range of -55°C to 105°C. Utilizing a highly reliable solderless Through Hole Press-Fit mounting mechanism, the 2007464-2 provides hardware architects with a mission-critical physical layer housing for core routers, ruggedized edge computing enclosures, and high-performance networking chassis optimized for belly-to-belly configurations.

Advanced Thermal Management (6.5mm Pin Heat Sink)

As network port speeds scale to 16 Gb/s, optical transceivers generate significant thermal loads. Traditional linear fin heat sinks depend heavily on specific unidirectional airflow. The 2007464-2 addresses complex thermal environments through its advanced pin architecture.

• Omnidirectional Pin Heat Sink: The integrated 6.5mm pin-style heat sink allows cooling air to flow through the thermal array from any direction. This makes it highly advantageous for complex chassis designs where airflow is turbulent, non-linear, or shared among multiple high-heat components.
• Riding Heat Sink Design: The heat sink assembly maintains direct, spring-loaded physical contact with the inserted SFP+ module. This maximizes thermal transfer away from the optical transceiver, preventing thermal throttling, reducing bit error rates, and extending the lifespan of sensitive internal PHY components.

  Typical Applications

  Combining 16 Gb/s bandwidth support, omnidirectional pin-style thermal management, and extreme temperature resilience, the 2007464-2 SFP+ cage assembly is the definitive physical layer solution for high-performance hardware:

  • Data Center Infrastructure: 10GbE / 16GFC Top-of-Rack (ToR) switches, aggregation routers, and high-density blade servers supporting Belly-to-Belly configurations with turbulent internal airflow.
  • Telecommunications & Edge: 5G baseband processing units (BBUs), optical transport network (OTN) equipment, and ruggedized outdoor telecom cabinets lacking active climate control.
  • Storage Area Networks (SAN): 16G Fibre Channel enterprise storage arrays and high-throughput host bus adapters (HBAs) requiring robust, multi-directional thermal dissipation.
  • Defense & Aerospace: Mission-critical communication hubs requiring military-grade temperature tolerances (-55°C to 105°C) and vibration-resistant press-fit mountings.