2057021-1 Shielded 16 Gb/s SFP+ Cage 1x1 Port Through Hole Solder NO Lightpipe

TE 2057021-1 1x1 SFP+ Cage Assembly

Engineered to deliver exceptional signal integrity and permanent mechanical stability in demanding data center and telecommunications infrastructure, the TE 2057021-1 is a premium 1x1 (single-port) SFP+ cage assembly. Designed as a ruggedized cable-to-board mechanical receptacle for high-speed Small Form-factor Pluggable (SFP+) optical transceivers and direct-attach copper (DAC) cables, this shielding cage reliably supports data transmission rates up to 16 Gb/s. Operating as a standalone mechanical housing, it is explicitly designed to envelop discrete surface-mount (SMT) SFP+ electrical connectors, granting hardware architects maximum layout flexibility on the printed circuit board (PCB).

Constructed from high-grade Nickel Silver, this cage assembly delivers intrinsic resistance to oxidation and robust mechanical durability across a military-grade temperature range of -55°C to 105°C. Utilizing a highly reliable Through Hole Solder / Press-Fit mounting mechanism, the 2057021-1 ensures precise PCB alignment and a permanent, vibration-resistant connection ideal for mission-critical networking hardware.

Single Port Architecture & PCB Integration

The discrete 1x1 port configuration serves as an essential mechanical foundation for modular, high-capacity aggregation routers, edge switches, and specialized telecommunications equipment requiring flexible, single-channel transceiver placements.

• Optimized PCB Geometry: Featuring a 2.05mm [0.081in] tail length, this cage is meticulously engineered to mount securely onto robust telecommunications logic boards requiring a recommended PCB thickness of 1.5mm [0.059in].
• Streamlined Front Panel (No Lightpipes): Designed explicitly without integrated lightpipes, this cage offers a clean, low-interference outer profile. This is highly advantageous for custom faceplate bezels or systems that rely on external, chassis-mounted diagnostic LEDs, significantly reducing internal trace routing complexity.

Advanced EMI Containment via Active Springs

Managing Electromagnetic Interference (EMI) at 16 Gb/s frequencies is a critical design mandate, especially in densely packed rack environments. The 2057021-1 achieves superior electromagnetic compatibility (EMC) through its advanced shielding construction.

• Active EMI Springs: Heavy-duty metallic EMI springs surround the front perimeter of the cage opening. These springs compress directly against the inner edge of the metallic chassis bezel, creating a continuous 360-degree, low-impedance electrical path to ground, effectively sealing the enclosure against external Radio Frequency Interference (RFI).
• High-Frequency Shielding: The robust Nickel Silver structure acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions generated by the PHY transceivers and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.

Mechanical Design & Manufacturing Reliability

Hardware engineers prioritize long-term mechanical reliability alongside high-yield automated manufacturing. The 2057021-1 leverages robust Through-Hole Technology (THT) to optimize the PCB assembly workflow.

• Through-Hole Mounting Stability: Engineered to accommodate both press-fit and solder assembly processes, the solid through-hole pins establish a permanent bond with the PCB. This heavily resists the mechanical stress, physical shock, and thermal cycling associated with frequent transceiver insertions in harsh environments.
• Extreme Thermal Endurance: The extended -55°C to 105°C operating range ensures uninterrupted physical protection for optics deployed in unconditioned outdoor enclosures, industrial factory floors, and aerospace applications.

Technical Specifications