2110929-1 SFP+ Cage 16 Gbs Included Lightpipe

SFP+ Cage, Data Rate (Max) 16 Gb/s, External Springs, SFP+, Included Lightpipe, 1 x 1, Dual Round, Reduced Length

The 2110929-1 is a high-density, industrial-grade 1x1 SFP+ Cage Assembly engineered to provide robust mechanical housing and electromagnetic shielding for pluggable I/O transceivers. Rated for a maximum data rate of 16 Gb/s, this receptacle is fully optimized for both 10G Ethernet (10GbE) and 16G Fibre Channel (16GFC) applications. A defining structural feature of this specific cage is its Reduced Length profile. This deliberate design minimizes the physical depth footprint on the motherboard, allowing PCB layout engineers to maximize dense board real estate and place routing components closer to the front bezel.

To ensure pristine signal integrity at 16 Gb/s, the 2110929-1 is constructed from highly durable Nickel Silver and features heavy-duty External EMI Springs. These springs establish continuous, 360-degree electrical grounding against the equipment chassis faceplate, critically containing RF leakage and ensuring strict FCC/CE electromagnetic compatibility. Furthermore, the assembly integrates a Dual Round Lightpipe. This structural addition allows engineers to route Link and Activity LED indicators from the underlying PCB directly to the front panel, eliminating the need for separate LED cutouts on the bezel and optimizing front-panel density.

Mechanically, the cage is tailored for high-yield, solderless manufacturing. It utilizes a Press-Fit termination (with a 2.05mm tail length) perfectly optimized for a standard 1.5mm recommended PCB thickness. This Press-Fit architecture is crucial for Design for Manufacturing (DFM), as it eliminates the extreme thermal stress associated with wave soldering on complex, high-layer-count motherboards, ensuring reliable long-term mechanical retention.

Uniquely, the 2110929-1 boasts an extreme Operating Temperature Range of -55°C to +105°C. This aerospace and industrial-grade thermal resilience guarantees zero mechanical degradation under severe environmental stress. It is the definitive SFP+ housing solution for ruggedized 5G telecom base stations, Storage Area Network (SAN) switches, unconditioned edge computing enclosures, and high-density data center routing platforms.