2110957-2 SFP 1X6 CAGE Assembly 8 Gbs Through Hole Press-Fit

TE 2110957-2 1x6 SFP Ganged Cage Assembly

Engineered to maximize faceplate I/O density in modern networking and telecommunications equipment, the TE 2110957-2 is a highly robust 1x6 (6-port) ganged SFP cage assembly. Designed as a unified cable-to-board interconnect solution, it houses Small Form-factor Pluggable (SFP) transceivers and direct-attach copper (DAC) cables, reliably supporting data transmission rates up to 8 Gb/s per channel. By consolidating six physical ports into a single, contiguous mechanical structure, data center architects and hardware designers can drastically optimize printed circuit board (PCB) real estate while simplifying complex high-speed routing.

Constructed from a premium Nickel Silver Alloy, this cage assembly delivers intrinsic resistance to oxidation and robust mechanical durability across a severe industrial temperature range of -55°C to 85°C. Utilizing a reliable solderless Through Hole Press-Fit mounting mechanism, the 2110957-2 ensures a permanent, highly secure mechanical connection to the PCB without subjecting the motherboard to the thermal stress of secondary reflow processes.

High-Density 1x6 Ganged Architecture

The ganged 1x6 port matrix is an essential configuration for high-capacity aggregation routers and enterprise edge switches. Compared to mounting six independent, single-port cages, the 2110957-2 guarantees perfect port-to-port horizontal alignment, providing a unified mechanical rigidity that streamlines high-volume chassis assembly. Rated for up to 8 Gb/s, it serves as the ideal physical housing for Gigabit Ethernet, robust SONET/SDH telecom links, and 8G Fibre Channel (8GFC) Storage Area Network (SAN) topologies.

Advanced EMI Containment & Shielding

Managing Electromagnetic Interference (EMI) at the chassis faceplate is a critical design mandate for high-frequency networking hardware. The 2110957-2 achieves superior electromagnetic compatibility (EMC) through its integrated shielding mechanisms.

• Multi-Point EMI Springs: Metallic EMI springs surround the front perimeter of the cage opening, ensuring continuous, low-impedance electrical contact with the metallic chassis bezel. This aggressively seals the enclosure against external Radio Frequency Interference (RFI).
• High-Frequency Containment: The premium Nickel Silver alloy acts as a Faraday shield, containing internal high-frequency emissions generated by the PHY transceivers, ensuring strict compliance with FCC, CE, and CISPR regulatory standards.
• Port-to-Port Isolation: The internal divider walls of the 1x6 ganged cage virtually eliminate near-end crosstalk (NEXT) and electromagnetic coupling between adjacent SFP modules.

Mechanical Design & Press-Fit PCB Integration

Hardware engineers prioritize long-term mechanical reliability and high-yield manufacturing. The 2110957-2 leverages advanced press-fit pin technology to achieve both, optimizing the PCB assembly workflow.

• Press-Fit (Compliant Pin) Technology: Eliminates the need for wave soldering. The cage features compliant pins with a 2.05mm [0.081in] tail length that press directly into plated through-holes (PTH) on the PCB. This creates a cold-welded, gas-tight electrical and mechanical connection that heavily resists vibration and thermal cycling.
• Optimized PCB Compatibility: The pin length and structural footprint are specifically tailored for standard telecommunications logic boards, requiring a recommended PCB thickness of 1.5mm for optimal engagement.
• Thermal Endurance: The military-grade -55°C to 85°C operating range ensures uninterrupted physical protection for optical modules in unconditioned outdoor enclosures, industrial factory floors, and aerospace applications.

Typical Applications

Offering massive 6-port density, rapid solderless assembly, and extreme temperature resilience, the 2110957-2 SFP cage is the optimal choice for high-bandwidth, ruggedized networking infrastructure:

• Telecommunications Infrastructure: Broadband aggregation routers, Central Office (CO) switches, and outdoor 5G cellular base station equipment.
• Enterprise & Data Center Networking: High-density Gigabit Ethernet switches, edge routing platforms, and core network aggregation devices.
• Storage Area Networks (SAN): 8G Fibre Channel storage area network arrays requiring uncompromised signal integrity and port density.
• Industrial & Edge Computing: Hardened Industrial Ethernet (IE) switches deployed in extreme manufacturing, outside plant (OSP), and energy sector environments.