2170193-1 SFP+ Cage Connector Press-Fit Through Hole Right Angle

TE 2170193-1 1x1 SFP+ Enhanced Cage Assembly

Engineered to deliver exceptional signal integrity and extreme environmental resilience in next-generation telecommunications and data center infrastructure, the TE 2170193-1 is a premium 1x1 (single-port) SFP+ Enhanced cage assembly. Designed as a highly durable, standalone mechanical receptacle to house high-speed Small Form-factor Pluggable (SFP+) optical transceivers and direct-attach copper (DAC) cables, this shielding cage reliably supports data transmission rates up to 16 Gb/s. It is meticulously designed for use with discrete surface-mount (SMT) SFP+ electrical connectors, granting hardware architects maximum layout flexibility on the printed circuit board (PCB).

Constructed from high-grade Nickel Silver, this cage assembly delivers intrinsic resistance to oxidation and robust mechanical durability across a military-grade temperature range of -55°C to 105°C. Utilizing a highly reliable solderless Through Hole Press-Fit mounting mechanism, the 2170193-1 ensures a permanent, gas-tight mechanical connection to the PCB, eliminating the thermal stress and potential PCB warping associated with secondary wave soldering.

SFP+ Enhanced Architecture & Visual Diagnostics

The discrete 1x1 port configuration serves as an essential mechanical foundation for modular, high-capacity aggregation routers, edge switches, and specialized telecommunications equipment.

• SFP+ Enhanced Compatibility: Fully optimized for the physical and electrical demands of SFP+ Enhanced pluggable I/O modules, ensuring exact mechanical alignment with standard 20-position SFP+ SMT electrical connectors for pristine 16 Gbps signal fidelity.
• Ultra-Low Profile Support: The cage architecture is designed to support Dual Round Lightpipes with an ultra-low standard profile, ensuring network administrators have immediate, unobstructed visual status indicators (such as Link and Activity) without compromising vertical chassis clearance.

Advanced EMI Containment via External Springs

Managing Electromagnetic Interference (EMI) at 16 Gb/s frequencies is a critical design mandate, especially in densely packed rack environments. The 2170193-1 achieves superior electromagnetic compatibility (EMC) through its advanced shielding construction.

• External EMI Springs: Heavy-duty metallic EMI springs surround the front perimeter of the cage opening. These external springs compress directly against the inner edge of the metallic chassis bezel, creating a continuous 360-degree, low-impedance electrical path to ground, effectively sealing the enclosure against external Radio Frequency Interference (RFI).
• High-Frequency Shielding: The robust Nickel Silver structure acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions generated by the PHY transceivers and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.

Mechanical Design & Press-Fit Manufacturing

Hardware engineers prioritize long-term mechanical reliability alongside high-yield automated manufacturing. The 2170193-1 leverages advanced compliant pin technology to optimize the PCB assembly workflow.

• Press-Fit (Compliant Pin) Technology: The cage utilizes a Through-Hole Press-Fit mounting style. The compliant pins are driven directly into plated through-holes (PTH) on the PCB, creating a cold-welded mechanical bond that heavily resists vibration, physical shock, and thermal cycling.
• Optimized PCB Geometry: Featuring a 2.05mm [0.081in] tail length, this cage is engineered to mount securely onto standard logic boards featuring a recommended PCB thickness of 1.5mm [0.059in], ensuring maximum retention force.