2170286-1 PRESS FIT SFP 2X4 Cage Assembly with Integrated Connector

TE 2170286-1 2x4 SFP Stacked Receptacle and Cage Assembly

Engineered to maximize faceplate I/O density in demanding data center architectures and ruggedized telecommunications equipment, the TE 2170286-1 is a highly integrated 2x4 (8-port) stacked SFP cage assembly. By organizing eight Small Form-factor Pluggable (SFP) ports into a dense, vertically stacked 2x4 matrix, this assembly allows hardware architects to drastically increase port capacity on standard 1U and 2U networking chassis. Crucially, it features an Integrated Electrical Connector, combining both the mechanical EMI shielding cage and the internal receptacles into a single, pre-aligned unit capable of supporting data rates up to 4 Gb/s per channel.

Constructed from premium Nickel Silver, this heavy-duty cage delivers superior structural rigidity and uncompromising resistance to corrosion. Featuring an extreme extended operating temperature range of -55°C to 105°C, the 2170286-1 guarantees mission-critical reliability for climate-controlled enterprise data centers, ruggedized military hardware, and unconditioned outdoor edge computing enclosures.

Integrated 2x4 Stacked Architecture & Receptacles

The ganged 2x4 port matrix is a foundational mechanical configuration for high-capacity aggregation routers and core edge switches.

• Pre-Aligned Electrical Interface: Unlike standalone cages that require discrete surface-mount SFP connectors, the 2170286-1 integrates the electrical receptacles directly into the assembly. This eliminates planar tolerance stack-up issues during printed circuit board (PCB) assembly and ensures flawless transceiver mating.
• Streamlined Front Panel (No Lightpipes): Designed explicitly without integrated lightpipes, this cage offers a clean, unobstructed outer profile. This reduces internal trace routing complexity for applications utilizing external, chassis-mounted diagnostic LEDs or custom faceplate bezels.
• 0.8mm Centerline Pitch: The precise 0.8mm [0.032in] contact pitch ensures exact alignment with standard SFP transceiver pads, maintaining optimal signal integrity across all 8 ports.

Advanced EMI Containment via External Springs

Managing Electromagnetic Interference (EMI) in high-density, multi-port chassis configurations is a critical design mandate. The 2170286-1 achieves superior electromagnetic compatibility (EMC) through its advanced shielding construction.

• External EMI Springs: Heavy-duty metallic EMI springs surround the perimeter of the port openings. These external springs compress directly against the inner edge of the metallic chassis bezel, creating a continuous 360-degree, low-impedance electrical path to ground, sealing the enclosure against external Radio Frequency Interference (RFI).
• Nickel Silver Shielding: The premium Nickel Silver alloy acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions generated by the PHY transceivers and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.
• Internal Isolation: Metallic dividers between the stacked and adjacent ports act as physical and electrical barriers, dramatically reducing near-end crosstalk (NEXT) and electromagnetic coupling across the 8-port matrix.

Mechanical Design & Press-Fit PCB Integration

Hardware engineers prioritize long-term mechanical reliability alongside high-throughput automated manufacturing. The 2170286-1 leverages advanced compliant pin technology to optimize the PCB assembly workflow.

• Press-Fit (Compliant Pin) Technology: The assembly utilizes a solderless Through-Hole Press-Fit mounting style. The compliant pins are driven directly into plated through-holes (PTH) on the PCB, creating a cold-welded, gas-tight mechanical bond that heavily resists vibration and eliminates the thermal stress associated with secondary wave soldering.
• Optimized Pin & PCB Geometry: Featuring a 3mm [0.118in] tail length, this connector is specifically engineered to mate securely with standard logic boards featuring a recommended PCB thickness of 1.5mm [0.059in].

Typical Applications

Combining massive 8-port stacked density, integrated electrical receptacles, a robust press-fit design, and military-grade thermal resilience (-55°C to 105°C), the 2170286-1 is the optimal interconnect housing for extreme-environment and high-throughput network architectures:

• Defense & Aerospace: Ruggedized military communication hubs and avionics systems subjected to massive temperature fluctuations and intense mechanical vibration.
• Telecommunications Infrastructure: Broadband access hubs, unconditioned outdoor 5G baseband units (BBUs), and fiber-to-the-x (FTTX) optical line terminals.
• Data Center & Enterprise Switching: High-density Gigabit Ethernet edge switches, Top-of-Rack (ToR) routers, and core network aggregation devices demanding visually clean stacked port matrices.
• Industrial & Edge Computing: Hardened industrial Ethernet switches and micro-data center nodes deployed in harsh manufacturing or energy sector environments.