The 2170614-1 is an ultra-ruggedized, aerospace-grade 1x1 SFP/SFP+ Cage Assembly, engineered to provide superior structural housing and aggressive electromagnetic containment for pluggable optical and copper transceivers. While mechanically compliant with advanced SFP+ and zSFP+ pluggable interfaces, this specific cage is targeted for highly stable 4 Gb/s data rates. This makes it the definitive structural bridge for integrating legacy 4G Fibre Channel (4GFC) Storage Area Networks (SAN) or legacy telecom optics into modern, standardized chassis designs without altering the physical faceplate architecture.

A defining mechanical advantage of the 2170614-1 is the pairing of its rigid Stainless Steel body with External EMI Springs. Stainless steel is explicitly selected for its exceptional mechanical yield strength, ensuring the cage resists structural deformation and port warping during severe transceiver insertion/extraction torque. To compensate for this extreme rigidity, external copper-alloy spring fingers actively compress against the chassis faceplate. In mixed-vendor deployments where sheet metal bezels exhibit unpredictable stamping tolerances, these springs absorb the structural variance. This establishes a continuous, low-impedance 360-degree grounding path, containing high-frequency RF leakage to ensure strict FCC/CE compliance. Furthermore, an integrated Dual Round Lightpipe routes PHY diagnostic LEDs from the motherboard directly to the front bezel, optimizing front-panel density and eliminating complex secondary LED mounting hardware.

Mechanically, the cage is tailored for high-yield, solderless manufacturing utilizing a Through-Hole Press-Fit termination. By eliminating the extreme thermal stress associated with wave soldering, the press-fit architecture preserves the plating integrity and impedance of adjacent high-speed signal vias. Notably, this model features an extended 3.0mm tail length paired with a standard 1.5mm recommended PCB thickness. This specific dimensional ratio ensures the EON (Eye-of-Needle) pins fully engage the entire depth of the PCB via, maximizing mechanical retention pull-force.

Built to survive unprecedented environmental stress, the 2170614-1 boasts an extreme Operating Temperature Range of -55°C to +105°C. This capability makes it the ultimate housing solution for unconditioned outdoor telecom base stations, ruggedized IoT edge gateways, and heavy-industrial control switches subjected to severe thermal loading.