2170705-7 ZQSFP+ Cage With Heat Sink 28 Gb/s With Lightpipe

F-tone 2170705-7 zQSFP+ 1x1 Cage Assembly with Heat Sink and Lightpipe (28 Gb/s)

Engineered to meet the thermal and signal integrity demands of next-generation 100G/400G networking equipment, the F-tone 2170705-7 is a premium zQSFP+ 1x1 (Single Port) Cage Assembly. Designed to house high-speed pluggable transceivers and direct-attach copper (DAC) cables, this advanced mechanical receptacle reliably supports data transmission rates up to 28 Gb/s per channel. By integrating an active heat sink and optical lightpipes directly into the cage structure, data center architects can maximize front-panel I/O density without compromising on thermal dissipation or port-level diagnostics.

Manufactured from high-grade Nickel Silver, this cage assembly delivers intrinsic resistance to oxidation and robust mechanical durability across a wide industrial temperature range of -40°C to 85°C. It is the definitive physical layer housing for mission-critical core routers, edge computing enclosures, and Top-of-Rack (ToR) data center switches requiring uncompromising 28 Gbps performance.

Integrated Thermal Management & Visual Diagnostics

As data rates scale to 28 Gb/s per lane (112G aggregate for zQSFP+), optical transceivers generate significant localized heat. The 2170705-7 mitigates this via its integrated mechanical architecture.

• Integrated Heat Sink: The cage features a precision-engineered riding heat sink that maintains direct physical contact with the inserted zQSFP+ module. This maximizes thermal transfer away from the optics and into the chassis airflow, preventing thermal throttling and extending transceiver lifespan.
• Built-In Lightpipes: High-density chassis designs often struggle with LED visibility. This cage includes integrated lightpipes that efficiently route diagnostic light from surface-mounted PCB LEDs directly to the front faceplate, providing administrators with immediate, unambiguous link and activity status.

Advanced EMI Containment (Internal & External Springs)

Managing Electromagnetic Interference (EMI) at 28 GHz frequencies requires aggressive containment strategies. The 2170705-7 utilizes a dual-layer spring shielding topology.

• External EMI Springs: Heavy-duty metallic springs surround the outer perimeter of the cage opening, creating a continuous 360-degree, low-impedance electrical bond with the metallic chassis bezel to seal the enclosure against external Radio Frequency Interference (RFI).
• Internal EMI Springs: Precision internal springs maintain constant pressure against the inserted zQSFP+ module housing, containing high-frequency emissions generated by the PHY transceiver itself and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.

Mechanical Design & Press-Fit PCB Integration

Hardware engineers prioritize long-term mechanical reliability and high-yield manufacturing. The 2170705-7 leverages advanced solderless technology to optimize the PCB assembly process.

• Press-Fit (Compliant Pin) Technology: The cage utilizes a Through-Hole Press-Fit mounting style. The 2.05mm [0.081in] compliant pins press directly into plated through-holes (PTH), establishing a cold-welded, gas-tight mechanical bond that resists physical vibration and eliminates the thermal stress of wave soldering.
• Optimized for Belly-to-Belly Layouts: The mechanical footprint is optimized for standard 1.57mm [0.062in] thick printed circuit boards and fully supports high-density "belly-to-belly" port matrix configurations, allowing switches to deploy ports on both the top and bottom of the PCB.