2291634-2 TE SFP+ Cage With Heat Sink 16 Gb/s Press-Fit Through Hole

TE 2291634-2 1x1 SFP+ Cage Assembly with 6.5mm Heat Sink

Engineered to solve the complex thermal and signal integrity challenges of modern data center and telecommunications infrastructure, the TE 2291634-2 is a premium 1x1 (single-port) SFP+ cage assembly. Designed to house high-speed Small Form-factor Pluggable (SFP+) optical transceivers and direct-attach copper (DAC) cables, this highly durable mechanical receptacle reliably supports data transmission rates up to 16 Gb/s. To combat the localized heat generated by high-frequency 10GbE and 16G Fibre Channel optics, this cage integrates a precision-engineered 6.5mm [0.255 in] finned heat sink, ensuring optimal passive thermal dissipation.

Constructed from a premium Copper Alloy, this cage assembly delivers intrinsic structural rigidity and superior electrical conductivity across an extreme military-grade temperature range of -55°C to 105°C. Utilizing a reliable solderless Through Hole Press-Fit mounting mechanism, the 2291634-2 provides hardware architects with a mission-critical physical layer housing for core routers, edge computing enclosures, and high-density networking chassis.

Advanced Thermal Management (Integrated Finned Heat Sink)

As network speeds scale to 16 Gb/s, optical transceivers generate significant thermal loads that can lead to throttling or premature component failure if not properly managed. The 2291634-2 directly addresses this through its mechanical architecture.

• Riding Heat Sink Design: The integrated 6.5mm finned heat sink maintains direct, spring-loaded physical contact with the inserted SFP+ module. This maximizes thermal transfer away from the optical transceiver and into the chassis airflow.
• Finned Topography: The finned structure dramatically increases the available surface area for convective cooling, ensuring stable operating temperatures even in densely packed, high-ambient-heat data center environments.

Advanced EMI Containment & Belly-to-Belly Integration

Managing Electromagnetic Interference (EMI) is a critical design mandate for high-frequency networking hardware. The 2291634-2 achieves superior electromagnetic compatibility (EMC) through its advanced shielding mechanisms.

• External EMI Springs: Heavy-duty metallic EMI springs surround the front perimeter of the cage opening. These springs compress directly against the inner edge of the metallic chassis bezel, creating a continuous 360-degree, low-impedance electrical path to ground, aggressively sealing the enclosure against external Radio Frequency Interference (RFI).
• Belly-to-Belly Support: The mechanical footprint is specifically optimized for SFP+ Stacked Belly-to-Belly applications. This allows hardware designers to mount identical cage assemblies on both the top and bottom surfaces of a shared PCB, effectively doubling port density within a 1U Rack Unit space without risking thermal or EMI crossover.
• Streamlined Front Panel (No Lightpipes): Designed explicitly without integrated lightpipes, reducing internal routing complexity for systems utilizing external, chassis-mounted diagnostic LEDs.

Mechanical Design & Press-Fit PCB Integration

Hardware engineers prioritize long-term mechanical reliability and high-yield manufacturing. The 2291634-2 leverages advanced solderless technology to streamline the PCB assembly workflow.

• Press-Fit (Compliant Pin) Technology: The cage utilizes a Through-Hole Press-Fit mounting style. The compliant pins press directly into plated through-holes (PTH) on the printed circuit board, establishing a cold-welded, gas-tight mechanical bond that heavily resists vibration and eliminates the thermal stress of secondary wave soldering.
• Extreme Thermal Endurance: The -55°C to 105°C operating range ensures uninterrupted physical and thermal protection for optics deployed in unconditioned outdoor enclosures, industrial factory floors, and aerospace applications.

Technical Specifications