2291634-3 TE SFP+ Cage With Heat Sink 16 Gb/s External Springs

TE 2291634-3 1x1 SFP+ Cage Assembly with 6.5mm Pin Heat Sink

Engineered to resolve the most demanding thermal and signal integrity challenges in next-generation telecommunications and data center infrastructure, the TE 2291634-3 is a premium 1x1 (single-port) SFP+ cage assembly. Designed to envelop and protect high-speed Small Form-factor Pluggable (SFP+) optical transceivers and direct-attach copper (DAC) cables, this highly durable mechanical receptacle reliably supports data transmission rates up to 16 Gb/s. To aggressively combat the localized heat generated by high-frequency 10GbE and 16G Fibre Channel optics, this cage integrates a precision-engineered 6.5mm [0.255 in] pin heat sink, providing superior omnidirectional passive thermal dissipation.

Constructed from a premium Nickel Silver Alloy, this cage assembly delivers intrinsic structural rigidity and outstanding resistance to oxidation across an extreme military-grade temperature range of -55°C to 105°C. Utilizing a highly reliable solderless Through Hole Press-Fit mounting mechanism, the 2291634-3 provides hardware architects with a mission-critical physical layer housing for core routers, ruggedized edge computing enclosures, and high-density networking chassis.

Advanced Thermal Management (Integrated Pin Heat Sink)

As network port speeds scale to 16 Gb/s, optical transceivers generate significant thermal loads. Traditional linear fin heat sinks depend heavily on specific unidirectional airflow. The 2291634-3 addresses complex thermal environments through its advanced pin architecture.

• Omnidirectional Pin Heat Sink: The integrated 6.5mm pin-style heat sink allows cooling air to flow through the thermal array from any direction. This makes it highly advantageous for complex chassis designs where airflow is turbulent or non-linear.
• Riding Heat Sink Design: The heat sink assembly maintains direct, spring-loaded physical contact with the inserted SFP+ module. This maximizes thermal transfer away from the optical transceiver, preventing thermal throttling and extending the lifespan of sensitive internal PHY components.

Advanced EMI Containment & Belly-to-Belly Integration

Managing Electromagnetic Interference (EMI) is a critical design mandate for high-frequency networking hardware operating in densely packed racks. The 2291634-3 achieves superior electromagnetic compatibility (EMC) through its dual-layer shielding mechanisms.

• Internal/External EMI Springs: Heavy-duty metallic EMI springs surround the front perimeter of the cage opening (external) and maintain pressure on the transceiver (internal). These springs compress directly against the metallic chassis bezel, creating a continuous 360-degree, low-impedance electrical path to ground, aggressively sealing the enclosure against Radio Frequency Interference (RFI).
• Belly-to-Belly Support: The mechanical footprint is specifically optimized for SFP+ Stacked Belly-to-Belly applications. This allows hardware designers to mount identical cage assemblies on both the top and bottom surfaces of a shared PCB, effectively doubling port density within a 1U Rack Unit space without risking thermal or EMI crossover.
• Streamlined Front Panel (No Lightpipes): Designed explicitly without integrated lightpipes, reducing internal routing complexity for systems utilizing external, chassis-mounted diagnostic LEDs.

Mechanical Design & Press-Fit PCB Integration

Hardware engineers prioritize long-term mechanical reliability alongside high-yield automated manufacturing. The 2291634-3 leverages advanced solderless technology to streamline the printed circuit board (PCB) assembly workflow.

• Press-Fit (Compliant Pin) Technology: The cage utilizes a Through-Hole Press-Fit mounting style. The compliant pins press directly into plated through-holes (PTH) on the PCB, establishing a cold-welded, gas-tight mechanical bond that heavily resists vibration and completely eliminates the thermal stress of secondary wave soldering.
• Nickel Silver Shielding: The premium alloy acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions to ensure strict compliance with FCC, CE, and CISPR regulatory standards.

Technical Specifications