2299056-1 TE SFP+ Cage With Heat Sink 16 Gb/s External Springs

TE 2299056-1 1x1 SFP+ Cage Assembly with 3.5mm Slug Heat Sink

Engineered to resolve severe vertical clearance constraints while maintaining uncompromised signal integrity, the TE 2299056-1 is a highly specialized 1x1 (single-port) SFP+ cage assembly. Designed to house high-speed Small Form-factor Pluggable (SFP+) optical transceivers and direct-attach copper (DAC) cables, this ruggedized mechanical receptacle reliably supports data transmission rates up to 16 Gb/s. To manage the thermal loads generated by 10GbE and 16G Fibre Channel optics within tight space limitations, this cage integrates a low-profile 3.5mm [0.137 in] slug-style heat sink, providing a high-mass conductive cooling solution without the vertical bulk of traditional finned arrays.

Constructed from a premium Nickel Silver Alloy, this cage assembly delivers intrinsic structural rigidity and outstanding resistance to oxidation across an extreme military-grade temperature range of -55°C to 105°C. Utilizing a highly reliable solderless Through Hole Press-Fit mounting mechanism tailored for standard 1.5mm thick motherboards, the 2299056-1 provides hardware architects with a mission-critical physical layer housing for ultra-compact routers, edge computing enclosures, and high-density networking chassis.

Low-Profile Thermal Management (Integrated Slug Heat Sink)

As network port speeds scale to 16 Gb/s, optical transceivers generate significant localized heat. In hardware enclosures where Z-axis clearance is severely restricted, traditional fin or pin heat sinks cannot be deployed. The 2299056-1 directly addresses this mechanical challenge.

• Slug-Style Thermal Mass: The integrated 3.5mm slug heat sink utilizes a dense, solid block design. It maintains direct, spring-loaded physical contact with the inserted SFP+ module, acting as a highly efficient thermal sponge that rapidly conducts heat away from the optic and transfers it to the surrounding chassis or specialized cooling plates.
• Ultra-Low Profile: With a height of just 3.5mm [0.137 in] above the cage, this thermal solution is perfectly optimized for ultra-thin 1U blade servers, compact telecom nodes, and embedded industrial systems.

Advanced EMI Containment & Belly-to-Belly Integration

Managing Electromagnetic Interference (EMI) is a critical design mandate for high-frequency networking hardware operating in densely packed environments. The 2299056-1 achieves superior electromagnetic compatibility (EMC) through its robust shielding mechanisms.

• Active EMI Springs: Heavy-duty metallic EMI springs surround the front perimeter of the cage opening. These springs compress directly against the inner edge of the metallic chassis bezel, creating a continuous 360-degree, low-impedance electrical path to ground, aggressively sealing the enclosure against external Radio Frequency Interference (RFI).
• Belly-to-Belly Support: The mechanical footprint is specifically optimized for SFP+ Stacked Belly-to-Belly applications. This allows hardware designers to mount identical cage assemblies on both the top and bottom surfaces of a shared PCB, effectively doubling port density within a confined rack unit space without risking thermal or EMI crossover.
• Streamlined Front Panel (No Lightpipes): Designed explicitly without integrated lightpipes, preserving the integrity of the EMI shield and reducing internal routing complexity for systems utilizing external, chassis-mounted diagnostic LEDs.

Mechanical Design & Press-Fit PCB Integration

Hardware engineers prioritize long-term mechanical reliability alongside high-yield automated manufacturing. The 2299056-1 leverages advanced compliant pin technology to streamline the printed circuit board (PCB) assembly workflow.

• Press-Fit (Compliant Pin) Technology: The cage utilizes a Through-Hole Press-Fit mounting style. The compliant pins press directly into plated through-holes (PTH) on the PCB, establishing a cold-welded, gas-tight mechanical bond that heavily resists vibration and completely eliminates the thermal stress of secondary wave soldering.
• Optimized Pin Geometry: Featuring a robust 3mm [0.118in] tail length, this cage is meticulously engineered to mount securely onto standard logic boards featuring a recommended PCB thickness of 1.5mm [0.059in], ensuring maximum retention force.

Technical Specifications