2317416-1 OSFP Cage Assembly Press-Fit Through Hole

TE Connectivity 2317416-1 Compatible OSFP Cage Assembly Technical Overview

The TE Connectivity 2317416-1 is a 1x1 OSFP cage assembly designed for applications requiring TE Connectivity 2317416-1 compatible mechanical specifications in 400G and 800G high-speed pluggable optical networking platforms. Featuring press-fit PCB mounting and integrated EMI shielding springs, it provides reliable module retention, electromagnetic interference control, and mechanical support for next-generation data center switches, AI networks, and telecom infrastructure.

• Mechanical Form Factor: 1x1 Single-Port OSFP Cage Assembly (Lightpipe-free low-profile footprint).
• Signal Ecosystem Support: Designed for OSFP systems supporting 112Gb/s PAM4 signaling architectures based on OSFP MSA mechanical requirements and IEEE 802.3 Ethernet standards.
• Board Mount Technology: Solderless Through-Hole Press-Fit connection (Compliant pin structure to avoid additional solder reflow exposure).
• Alternative Sourcing Option: Multi-source engineering options are available to support secondary sourcing strategies, BOM cost optimization, and supply chain flexibility.
• Target Applications: Designed for AI data center switches, hyperscale networking platforms, and telecom systems requiring high-density 400G/800G optical connectivity.

Key Benefits of TE Connectivity 2317416-1 OSFP Cage Assembly

• High-Speed Optical Interface Integration: Supports next-generation OSFP optical modules used in high-bandwidth 400G and 800G networking platforms.
• Reliable Mechanical Retention: Provides secure module insertion and extraction cycles for demanding data center switch environments.
• Enhanced EMI Containment: Metallic cage construction and perimeter EMI spring contacts help minimize electromagnetic leakage around pluggable interfaces.
• Thermal Management Support: Provides mechanical clearance and airflow compatibility for high-density OSFP optical modules used in power-intensive 400G and 800G networking systems.
• Manufacturing Flexibility: Press-fit mounting simplifies PCB assembly processes and avoids additional solder reflow thermal exposure.
• Multi-Source Availability: Industry-standard mechanical design enables secondary sourcing strategies to improve supply chain flexibility, lead-time management, and BOM optimization.

1x1 OSFP Cage Architecture for 400G and 800G Ethernet Systems

Designed around OSFP MSA mechanical requirements, the TE Connectivity 2317416-1 is a single-port (1x1) OSFP cage assembly. It serves as the physical chassis foundation required to house high-speed interconnects, supporting optical modules based on 400G and 800G Ethernet architectures, including PAM4-based signaling implementations defined by industry standards.

Single-Port OSFP Mechanical Architecture & PCB Integration

The standalone 1x1 port matrix layout provides hardware PCB designers optimal placement flexibility across the system board. Unlike multi-port ganged cage configurations, a discrete single-port OSFP cage simplifies high-speed differential trace routing, minimizes channel insertion loss variability to surface-mount (SMT) OSFP electrical connectors, and prevents trace congestion on ultra-dense line cards.

EMI Shielded OSFP Cage Design for High-Speed PAM4 Applications

High-speed OSFP interfaces supporting 112Gb/s PAM4 signaling require careful electromagnetic compatibility (EMC) design and mechanical shielding to control radiated emissions and signal integrity risks.

360-Degree Metallic EMI Spring Gaskets

The cage integrates metallic EMI spring contacts around the module opening, creating a conductive shielding interface between the cage assembly and chassis enclosure. When integrated into the chassis front panel cutout, these springs compress firmly against the metallic bezel, establishing a reliable ground interface around the module opening to improve EMI containment performance.

High-Frequency Shielding Structure

Constructed from a high-conductivity copper alloy, the solid metallic housing functions as a metallic EMI shielding structure. It contains internal high-frequency noise generated by optoelectronic components while shielding board-level differential traces from external electromagnetic fields, supporting system-level EMC design requirements for equipment targeting FCC and CE regulatory environments.

Press-Fit OSFP Cage Features and PCB Integration

To support automated, high-yield manufacturing, the 2317416-1 is engineered with precision mechanical press-fit pins that interface directly with standard PCB plated through-holes.

Solderless Compliant Pin Press-Fit Integration

Equipped with precision compliant press-fit pins, the cage mounts onto the PCB via mechanical insertion into plated through-holes (PTH). This Through-Hole Technology (THT) avoids additional solder reflow exposure on the PCB substrate, reduces exposure to solder-related thermal stress, and simplifies board repairability.

Thermal Management and Mechanical Reliability

Built to endure demanding environmental conditions, the 2317416-1 retains structural integrity and pin contact normal force across an extended operating temperature range of -55°C to +85°C. Designed explicitly without integrated lightpipes, its low-profile outer envelope accommodates custom front-panel layouts and provides thermal design flexibility for chassis airflow management in high-density rack configurations.

Target Applications: AI Data Centers, Telecom and Enterprise Networks

Combining OSFP MSA mechanical compliance, EMI shielding effectiveness, and press-fit mounting durability, the TE Connectivity 2317416-1 supports mission-critical deployments across advanced networking architectures:

• AI Data Center Networking: Designed for GPU clusters, AI fabrics, and high-bandwidth computing infrastructure requiring dense 400G/800G optical connectivity.
• Hyperscale 400G/800G Data Center Fabrics: Optimized for Top-of-Rack (ToR) switches, spine routers, and optical switching fabrics demanding continuous transceiver insertion durability.
• Carrier-Grade Telecom Infrastructure: Suitable for deployment in 5G mobile backhaul aggregation routers, Optical Transport Networks (OTN), and unconditioned edge compute enclosures.

Technical Specifications