2338495-3 TE OSFP Cage Ganged (1 x 4) Connector Press-Fit Through Hole

Key Benefits of TE Connectivity 2338495-3 OSFP Cage Assembly

• Ultra-High 1x4 Quad-Port Density (Up to 3.2 Tbps Aggregate Bandwidth): Consolidates four 800G OSFP ports into a single integrated 1x4 housing, maximizing front-panel I/O throughput in 1RU/2RU switch chassis.
• Streamlined Lightpipe-Free Unobstructed Airflow Envelope: Flat top profile eliminates lightpipe optic channels, maximizing vertical clearance for custom riding heatsinks, liquid cooling cold plates, or chassis forced airflow.
• High-Speed Optical Interface Integration: Supports next-generation OSFP optical transceivers, Active Optical Cables (AOCs), and Direct Attach Copper (DAC) interconnects used in 400G and 800G networking platforms.
• Advanced EMI Containment for 112G PAM4: Heavy-duty metallic cage construction and perimeter EMI spring gasket contacts help minimize electromagnetic leakage around pluggable interfaces at high Nyquist frequencies (28 GHz).
• Solderless Press-Fit Manufacturing Flexibility: Precision compliant press-fit pins simplify board assembly, increase manufacturing yields, and avoid additional solder reflow thermal exposure on multi-layer PCB substrates.
• Multi-Source Availability: Industry-standard footprint allows deployment alongside compatible replacement alternatives from qualified suppliers like LINK-PP for BOM cost optimization.

1x4 OSFP Cage Architecture & 400G/800G MSA Compliance

Designed around OSFP MSA mechanical requirements (Rev 4.0/5.0), the TE Connectivity 2338495-3 is a 1x4 ganged (four side-by-side ports) OSFP cage assembly. It serves as the physical chassis foundation required to house high-speed 400G (8x50G PAM4) and 800G (8x100G PAM4) optical transceivers, AOCs, and DAC interconnects on high-density line cards.

Quad-Port Ganged Architecture & Signal Integrity Optimization

The ganged 1x4 port matrix layout provides system hardware designers with an optimal balance between port density and PCB trace routing budget. Consolidating four ports into a single housing establishes precise port-to-port pitch across the chassis front bezel, simplifies high-speed 100Ω differential pair routing, minimizes channel insertion loss variability to surface-mount (SMT) OSFP electrical connectors, and prevents trace congestion on ultra-dense line cards.

EMI Shielded OSFP Cage Design for High-Speed 112G PAM4 Applications

High-speed OSFP interfaces supporting 112Gb/s PAM4 per-lane signaling require careful electromagnetic compatibility (EMC) design and mechanical shielding to control radiated emissions and signal integrity risks.

360-Degree Active Metallic EMI Spring Gaskets

The TE Connectivity 2338495-3 features heavy-duty, highly resilient metallic EMI gasket springs fitted around the entire outer perimeter of all four module port openings. When integrated into the chassis front panel cutout, these springs compress firmly against the metallic bezel, establishing a continuous, low-impedance grounding interface around the module openings to improve EMI containment performance.

High-Frequency Shielding Structure

Constructed from a high-conductivity copper alloy with nickel plating, the solid metallic housing functions as an effective EMI shielding structure. It contains internal high-frequency noise generated by optoelectronic components while shielding board-level differential traces from external electromagnetic fields, supporting system-level EMC design requirements for equipment targeting FCC and CE regulatory environments.

Press-Fit OSFP Cage Features and PCB Assembly Integration

To support automated, high-yield manufacturing on dense motherboard layouts, the 2338495-3 is engineered with precision mechanical press-fit pins that interface directly with standard PCB plated through-holes.

Solderless Compliant Pin Press-Fit Integration

Equipped with precision compliant press-fit pins, the cage mounts onto the host PCB via mechanical insertion into plated through-holes (PTH). This Through-Hole Technology (THT) avoids additional solder reflow exposure on the PCB substrate, reduces exposure to solder-related thermal stress, and simplifies board repairability.

Thermal Management and Operating Temperature Reliability

Built to endure demanding environmental conditions, the 2338495-3 retains structural integrity and pin contact normal force across an extended operating temperature range of -55°C to +85°C [-67°F to +185°F]. Its low-profile lightpipe-free profile maximizes vertical clearance above the cage, accommodating customized riding heatsinks, heat pipes, or direct-to-chip liquid cooling cold plates necessary for managing high-wattage 800G optical modules (up to 14W–20W per port).

Target Applications: AI Data Centers, Hyperscale Fabrics and Telecom Networks

Combining OSFP MSA mechanical compliance, EMI shielding effectiveness, lightpipe-free thermal clearance, and press-fit mounting, the TE Connectivity 2338495-3 supports mission-critical deployments across advanced networking architectures:

• AI / GPU Compute Networks: Used in AI/HPC supercomputing platforms (e.g., NVIDIA Quantum/Spectrum fabrics, GPU clusters) requiring high-density 800G OSFP interfaces with unobstructed cooling clearance.
• Hyperscale 400G/800G Data Center Fabrics: Optimized for Top-of-Rack (ToR) switches, spine routers, and optical switching fabrics demanding continuous transceiver insertion durability.
• Carrier-Grade Telecom Infrastructure: Suitable for deployment in 5G mobile backhaul aggregation routers, Optical Transport Networks (OTN), and unconditioned edge compute enclosures.