F-tone FT21AC01001 2x1 Port SFP Cage Connector Without LightPipe

F-tone FT21AC01001 2x1 Port SFP Stacked Receptacle and Cage Assembly

Engineered to maximize faceplate I/O density while streamlining printed circuit board (PCB) assembly, the F-tone FT21AC01001 is a highly integrated 2x1 (stacked) SFP cage and receptacle assembly. By vertically stacking two Small Form-factor Pluggable (SFP) ports within a narrow 14.00mm footprint, this connector allows data center architects and hardware designers to effectively double the port capacity of a standard 1U or 2U chassis. Unlike standalone cages, this comprehensive module integrates both the mechanical EMI shielding cage and the electrical receptacle into a single, pre-aligned unit.

Constructed from a premium Copper Alloy with 30u" plating, this robust cage assembly delivers superior structural integrity and long-term resistance to oxidation. With a rugged industrial operating temperature range of -40°C to +85°C, the FT21AC01001 ensures mission-critical reliability for both climate-controlled enterprise data centers and unconditioned outdoor edge computing environments. This specific variant is designed without integrated lightpipes, making it ideal for streamlined faceplates or systems utilizing external, chassis-mounted diagnostic LEDs.

Integrated 2x1 Stacked Architecture

The ganged 2x1 port matrix is an essential configuration for high-capacity aggregation routers, edge switches, and industrial telecommunications equipment.

• Integrated Electrical Interface: Features a built-in SFP electrical receptacle. This pre-aligned integration eliminates the tolerance stack-up issues commonly associated with placing discrete connectors beneath separate cages, ensuring flawless transceiver insertion every time.
• Vertical Space Optimization: Stacking two SFP ports vertically optimizes PCB real estate, enabling 48-port or higher density configurations on standard rack-mount logic boards.
• Streamlined Front Panel: The absence of lightpipes simplifies the mechanical profile, reducing potential interference in densely packed, custom-bezel hardware designs.

Advanced EMI Containment & Shielding

Managing Electromagnetic Interference (EMI) in high-density, multi-port chassis configurations is a critical design mandate. The FT21AC01001 achieves superior electromagnetic compatibility (EMC) through its heavy-duty construction.

• Continuous Shielding: The premium copper alloy cage acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions generated by the PHY transceivers and ensuring strict compliance with FCC and CE regulatory standards.
• Chassis Grounding: Designed to mate seamlessly with metallic chassis bezels, the cage creates a low-impedance electrical path to ground, sealing the enclosure against external Radio Frequency Interference (RFI).
• Port-to-Port Isolation: Internal metallic dividers between the upper and lower receptacles act as physical and electrical barriers, dramatically reducing near-end crosstalk (NEXT) between stacked SFP modules.

Mechanical Design & Press-Fit PCB Integration

Hardware engineers prioritize long-term mechanical reliability and high-yield manufacturing. The FT21AC01001 leverages advanced solderless technology to optimize the assembly workflow.

• Press-Fit (Compliant Pin) Technology: The cage utilizes a Through-Hole Press-Fit mounting style. The compliant pins are driven directly into plated through-holes (PTH) on the PCB, creating a cold-welded, gas-tight mechanical bond that heavily resists vibration, physical shock, and eliminates the thermal stress of secondary wave soldering.
• Optimized PCB Compatibility: Specifically designed for heavier telecom-grade boards, requiring a recommended PCB thickness of 2.36mm (0.093 inches) to ensure proper press-fit engagement and long-term mechanical stability.

Typical Applications

Combining massive stacked port density, industrial-grade thermal resilience, and a streamlined press-fit design, the FT21AC01001 is the optimal interconnect solution for high-throughput network architecture:

• Data Center & Enterprise Switching: High-density Top-of-Rack (ToR) switches, core routers, and network aggregation devices demanding stacked port matrices.
• Telecommunications Infrastructure: Broadband access hubs, 5G baseband units (BBUs), and fiber-to-the-x (FTTX) optical line terminals (OLTs).
• Industrial & Edge Computing: Ruggedized industrial Ethernet switches and micro-data center nodes deployed in extreme temperature environments (-40°C to +85°C).
• Network Security: Next-generation firewalls, intrusion detection systems (IDS), and unified threat management (UTM) hardware.