F-tone FT21AC02001 SFP 2x1 Cage Connector Press-Fit Through Hole, Right Angle

F-tone FT21AC02001 2x1 Port SFP Stacked Cage Connector

Engineered to maximize faceplate I/O density in demanding data center and telecommunications infrastructure, the FT21AC02001 is a highly robust 2x1 (stacked) SFP cage assembly. By vertically stacking two Small Form-factor Pluggable (SFP) ports into a streamlined 14.00mm wide footprint, this right-angle cage allows hardware architects to effectively double the port capacity of a standard 1U or 2U chassis. Designed specifically for integration with stacked electrical receptacles, this cage provides critical mechanical alignment and structural protection for pluggable transceivers.

Constructed from a premium Nickel-Plated Copper Alloy, this heavy-duty cage delivers superior structural rigidity and uncompromising resistance to corrosion. Featuring an extreme industrial operating temperature range of -40°C to +85°C, the LP21AC02001 guarantees mission-critical reliability for both climate-controlled enterprise data centers and unconditioned outdoor edge computing environments.

High-Density 2x1 Stacked Architecture

The ganged 2x1 port matrix is an essential mechanical configuration for modern high-capacity aggregation routers and edge switches.

• Vertical Space Optimization: Stacking two SFP ports vertically minimizes printed circuit board (PCB) real estate, enabling 48-port or higher density configurations on standard rack-mount logic boards.
• Streamlined Front Panel: Designed without integrated lightpipes, this cage offers a clean, low-interference mechanical profile. This is highly advantageous for custom-bezel hardware designs or systems that utilize external, chassis-mounted diagnostic LEDs.
• Precision Transceiver Guidance: Acts as a rigid mechanical guide rail system, absorbing the physical stress of frequent SFP transceiver insertion and extraction, thereby protecting the delicate electrical connectors on the PCB.

Advanced EMI Containment & Shielding

Managing Electromagnetic Interference (EMI) in high-density, multi-port chassis configurations is a critical design mandate. The FT21AC02001 achieves superior electromagnetic compatibility (EMC) through its advanced shielding design.

• Nickel-Plated Copper Construction: The premium alloy acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions generated by PHY transceivers and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.
• Active EMI Springs: Heavy-duty metallic EMI springs surround the perimeter of the port openings. These springs ensure continuous, low-impedance electrical contact with the metallic chassis bezel, aggressively sealing the enclosure against external Radio Frequency Interference (RFI).
• Port-to-Port Isolation: Internal metallic dividers between the upper and lower ports act as physical and electrical barriers, dramatically reducing near-end crosstalk (NEXT) between the stacked SFP modules.

Mechanical Design & Press-Fit PCB Integration

Hardware engineers prioritize long-term mechanical reliability and high-yield automated manufacturing. The FT21AC02001 leverages advanced solderless technology to optimize the PCB assembly workflow.

• Press-Fit (Compliant Pin) Technology: The cage utilizes a Through-Hole Press-Fit mounting style. The compliant pins are driven directly into plated through-holes (PTH) on the PCB, creating a cold-welded, gas-tight mechanical bond that heavily resists vibration, physical shock, and eliminates the thermal stress associated with wave soldering.
• Tray Packaging for Automation: Supplied in standard tray packaging, ensuring component protection during transit and seamless integration into automated factory floor assembly lines.

Typical Applications

Combining massive stacked port density, industrial-grade thermal resilience, and a robust press-fit design, the FT21AC02001 is the optimal interconnect housing for high-throughput network architectures:

• Data Center & Enterprise Switching: High-density Top-of-Rack (ToR) switches, core edge routers, and network aggregation devices demanding stacked port matrices.
• Telecommunications Infrastructure: Broadband access hubs, 5G baseband units (BBUs), and fiber-to-the-x (FTTX) optical line terminals (OLTs).
• Industrial & Edge Computing: Ruggedized industrial Ethernet switches and micro-data center nodes deployed in extreme temperature environments (-40°C to +85°C).
• Network Security: Next-generation firewalls, intrusion detection systems (IDS), and unified threat management (UTM) hardware requiring robust EMI containment.