F-tone FT24AC01001 2x4 Port SFP Cage Connector Without LightPipe

F-tone FT24AC01001 2x4 Port SFP Stacked Receptacle and Cage Assembly

Engineered to maximize faceplate I/O density in demanding data center and telecommunications infrastructure, the FT24AC01001 is a highly integrated 2x4 (8-port) stacked SFP cage and receptacle assembly. By organizing eight Small Form-factor Pluggable (SFP) ports into a compact, vertically stacked 2x4 matrix, this assembly empowers hardware architects to drastically increase port capacity on standard 1U and 2U networking chassis. Integrating both the mechanical EMI shielding cage and the electrical receptacles into a single, pre-aligned unit eliminates tolerance stack-up issues during printed circuit board (PCB) assembly and ensures flawless transceiver mating.

Constructed from a premium 0.25mm thick Copper Alloy with 30u" minimum Nickel Plating, this heavy-duty cage delivers superior structural rigidity and uncompromising resistance to corrosion. Internal plastic housings are molded from High Temperature LCP (Liquid Crystal Polymer) meeting UL94 V-0 flammability standards. Featuring an extreme industrial operating temperature range of -40°C to +85°C, the FT24AC01001 guarantees mission-critical reliability for both climate-controlled enterprise data centers and unconditioned outdoor edge computing enclosures.

High-Density 2x4 Stacked Architecture

The ganged 2x4 port matrix is a foundational mechanical configuration for high-capacity aggregation routers and core edge switches where front-panel real estate is at an absolute premium.

• Integrated Electrical Interface: Pre-aligning the 8 integrated SFP receptacles within the cage structure drastically streamlines manufacturing, ensuring exact pin-to-pad alignment for high-speed signal integrity.
• Streamlined Front Panel (No Lightpipes): Designed explicitly without integrated lightpipes, this cage offers a clean, unobstructed outer profile. This is highly advantageous for custom-bezel hardware designs or systems that utilize external, chassis-mounted diagnostic LEDs, reducing internal optical routing complexity.
• High-Temperature LCP Housing: The use of UL94 V-0 rated High Temperature Liquid Crystal Polymer ensures the internal connector housings maintain dimensional stability even under extreme thermal stress.

Advanced EMI Containment & Shielding

Managing Electromagnetic Interference (EMI) in high-density, 8-port chassis configurations is a critical design mandate. The FT24AC01001 achieves superior electromagnetic compatibility (EMC) through its advanced shielding design.

• 0.25mm Nickel-Plated Copper Alloy: The thick, premium alloy acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions generated by PHY transceivers and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.
• Stainless Steel EMI Springs: Heavy-duty stainless steel EMI springs surround the perimeter of the port openings. These springs ensure continuous, low-impedance electrical contact with the metallic chassis bezel, aggressively sealing the enclosure against external Radio Frequency Interference (RFI).
• Port-to-Port Isolation: Internal metallic dividers act as physical and electrical barriers, dramatically reducing near-end crosstalk (NEXT) and electromagnetic coupling between adjacent and stacked SFP modules.

Mechanical Design & Automated PCB Integration

Hardware engineers prioritize long-term mechanical reliability alongside high-yield automated manufacturing. The FT24AC01001 leverages advanced structural technology to optimize the PCB assembly workflow.

• Optimized for Thick PCBs: Specifically designed for heavier, multi-layer telecom-grade boards, requiring a recommended PCB thickness of 2.36mm (0.093 inches) to ensure proper mounting engagement and long-term mechanical stability.
• Tray Packaging for Automation: Supplied in standard tray packaging, ensuring delicate compliant pins and internal contacts are protected during transit and allowing for seamless integration into automated factory floor pick-and-place assembly lines.

Typical Applications

Combining massive 8-port stacked density, industrial-grade thermal resilience, UL94 V-0 safety compliance, and robust stainless steel EMI shielding, the FT24AC01001 is the optimal interconnect housing for high-throughput network architectures:

• Data Center & Enterprise Switching: High-density Top-of-Rack (ToR) switches, core edge routers, and network aggregation devices demanding space-saving, 8-port stacked matrices.
• Telecommunications Infrastructure: Broadband access hubs, 5G baseband units (BBUs), and fiber-to-the-x (FTTX) optical line terminals (OLTs).
• Industrial & Edge Computing: Ruggedized industrial Ethernet switches and micro-data center nodes deployed in extreme temperature environments (-40°C to +85°C).
• Storage Area Networks (SAN): High-throughput Fibre Channel storage arrays and host bus adapters (HBAs) requiring dense physical layer protection.