1761327-2 SFP Receptacle with Cage 20 x 12 Position Ganged (2x6) Connector Solder Through Hole

TE1761327-2 2x6 SFP Stacked Receptacle and Cage Assembly

Engineered to deliver massive faceplate I/O density for next-generation telecommunications and data center infrastructure, the TE 1761327-2 is a highly integrated 2x6 (12-port) stacked SFP cage and receptacle assembly. By organizing 12 Small Form-factor Pluggable (SFP) ports into a dense, vertically stacked 2x6 matrix, this assembly empowers hardware architects to radically increase port capacity on standard 1U and 2U networking chassis. Integrating both the mechanical EMI shielding cage and the 240-position electrical receptacles into a single unit eliminates tolerance stack-up issues during printed circuit board (PCB) assembly and ensures flawless mating for high-speed transceivers operating up to 16 Gb/s per channel.

Built to endure severe environmental extremes, this heavy-duty cage assembly delivers robust mechanical durability across a military-grade temperature range of -55°C to 105°C. Utilizing an optimized Through-Hole Solder mounting mechanism augmented by integrated board guides, the 1761327-2 guarantees mission-critical reliability for climate-controlled enterprise data centers, ruggedized aerospace hardware, and unconditioned outdoor edge computing enclosures.

Integrated 2x6 Stacked Architecture & Receptacles

The ganged 2x6 port matrix provides 12 high-speed physical ports, establishing a foundational mechanical configuration for high-capacity aggregation routers and core edge switches.

• 240-Position Electrical Interface: Features integrated 20-pin receptacles for all 12 ports. Pre-aligning the electrical interfaces within the cage structure drastically streamlines manufacturing and ensures exact pin-to-pad alignment for high-speed 16 Gbps signal integrity.
• Premium Contact Finish: The internal electrical contacts feature a heavy-duty 30.0μin (0.76μm) Gold plating, providing superior resistance against fretting corrosion and ensuring low contact resistance over thousands of mating cycles.
• Streamlined Front Panel (No Lightpipes): Designed explicitly without integrated lightpipes, this cage offers a clean, unobstructed outer profile. This reduces internal trace routing complexity for applications utilizing external, chassis-mounted diagnostic LEDs.

Advanced EMI Containment via Active Springs

Managing Electromagnetic Interference (EMI) in high-density, 12-port chassis configurations operating at 16 Gb/s is a critical design mandate. The 1761327-2 achieves superior electromagnetic compatibility (EMC) through its advanced shielding construction.

• Active EMI Springs: Heavy-duty metallic EMI springs surround the perimeter of the port openings. These external springs compress directly against the inner edge of the metallic chassis bezel, creating a continuous 360-degree, low-impedance electrical path to ground, aggressively sealing the enclosure against external Radio Frequency Interference (RFI).
• High-Frequency Shielding: The robust metallic cage acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions generated by the PHY transceivers and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.
• Port-to-Port Isolation: Internal metallic dividers between the stacked and adjacent columns act as physical and electrical barriers, dramatically reducing near-end crosstalk (NEXT) and electromagnetic coupling across the 12-port matrix.

Mechanical Design & PCB Integration

Hardware engineers prioritize long-term mechanical reliability alongside high-throughput automated manufacturing. The 1761327-2 leverages advanced alignment and mounting technology to optimize the PCB assembly workflow.

• Through-Hole Solder Integration: Engineered for highly reliable wave soldering processes. The through-hole structural pins ensure a permanent mechanical bond capable of withstanding the substantial insertion and extraction forces applied to a 12-port ganged block.
• Integrated Board Guides: Features precision board guides (alignment posts) that secure the component to the PCB prior to soldering, preventing structural skew during automated assembly and ensuring perfectly seated, low-impedance solder joints.

Typical Applications

Combining massive 12-port stacked density, integrated premium electrical receptacles, a resilient mounting design, and extreme thermal tolerance (-55°C to 105°C), the 1761327-2 is the optimal interconnect housing for demanding network architectures:

• Data Center & Enterprise Switching: High-density Gigabit and 10G Ethernet edge switches, Top-of-Rack (ToR) routers, and core network aggregation devices demanding space-saving 2x6 port matrices.
• Telecommunications Infrastructure: Broadband access hubs, unconditioned outdoor 5G baseband units (BBUs), and high-capacity fiber-to-the-x (FTTX) optical line terminals.
• Storage Area Networks (SAN): 16G Fibre Channel storage arrays and high-throughput Host Bus Adapters (HBAs) requiring dense physical layer protection.
• Defense & Aerospace: Ruggedized military communication hubs and avionics systems subjected to massive temperature fluctuations and intense mechanical vibration.