FT-OSFP-1.6T-DR8+ 1.6T OSFP DR8+ PAM4 1311nm 2km MPO-16 SMF Optical Transceiver Modulee
Designed to accelerate the bandwidth evolution of next-generation cloud networks and AI/ML training clusters, the FT-OSFP-1.6T-DR8+ module delivers an aggregate data rate of 1.6Tbps through 8 lanes of 200G PAM4 signaling. Operating at 1311nm with enhanced optical link budgets, it extends transmission up to 2km over Single Mode Fiber (SMF)—doubling the reach of standard DR8 modules—making it ideal for campus-scale interconnects and extended-reach spine-leaf architectures.
Built on the hot-pluggable OSFP form factor with support for IHS/Finned Top thermal designs, this module interfaces via a MPO-16 (APC) connector, enabling flexible configurations including 1x1.6T, 2x800G, 4x400G, or 8x200G breakout. Fully compliant with IEEE 802.3df (Draft), OSFP1600 MSA, and CMIS 5.x, it ensures seamless interoperability within multi-vendor NVIDIA Spectrum-X, Quantum-X800, and open Ethernet ecosystems.
Key Features
Extended Reach Performance: 2km transmission over SMF at 1311nm (DR8+ specification) for inter-row and inter-building DCI.
Massive Bandwidth Density: 8x 212.5Gbps (PAM4) optical/electrical lanes achieving 1.6Tb/s aggregate throughput.
Parallel Optical Interface: MPO-16 connector supporting 8-fiber parallel transmission for high-density deployment.
Advanced Modulation: 200G/lane PAM4 signaling with DSP-based signal recovery for superior BER performance.
Thermal Optimization: OSFP housing compatible with Finned Top/IHS for <30W power dissipation in high-density racks.
Comprehensive Management: Digital Diagnostic Monitoring (DDM) via I²C with CMIS 5.x compliance.
Standards Alignment: Compliant with OSFP MSA, IEEE 802.3df, RoHS, and REACH.
Target Applications
1.AI/ML Backend Fabrics: Scaling GPU clusters requiring 1.6T uplinks with >500m reach.
2.Hyperscale Data Centers: Spine-leaf upgrades from 800G to 1.6T with existing SMF MPO plants.
3.Campus Interconnects (DCI): 2km reach for connectivity between data halls or colocation buildings.
4.High-Performance Computing (HPC): Exascale fabrics demanding deterministic, low-latency parallel optics.
Bridge the distance gap in ultra-high-speed networks with the OSFP-1.6T-DR8+—engineered for the extended reach and density requirements of tomorrow’s accelerated infrastructure.
| F-toneP/N | OSFP-1.6T-DR8+ | Vendor Name | F-tone Networks |
| Form Factor | OSFP | Max Data Rate | 1x1.6T, 2x800G, 4x400G, 8x200G |
| Wavelength | 1311nm | Max Distance | 2km |
| Modulation Format | PAM4 | Connector | MTP/MPO-16 |
| Voltage Supply | 3.3V | Cable Type | SMF |
| Operation Temperature | 0 to 70°C (32 to 158°F) | Protocols | OSFP1600 MSA |
| Operation Temperature | 0 to 70°C (32 to 158°F) | Protocols | IB XDR, 1.6T Ethernet Compliant |
Important Notice
Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by F-tone Networks before they become applicable to any particular order or contract. In accordance with the F-tone Networks policy of continuous improvement specifications may change without notice.
The publication of information in this data sheet does not imply freedom from patent or other protective rights of F-tone Networks or others. Further details are available from any F-tone Networks sales representative.
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Power and Wavelength Testing
Test the signal delivering strength and wavelength, to ensure the signal decoding capacity of the receiver, and the wavelength remains consistent from the transmitter to the receiver.
Traffic Testing
Test the bit error rate and packet loss rate, to make them meet the corresponding standards and ensure the performance of transceivers.
Optical Performance Testing
Test the transceivers' eye diagram situation, receiving sensitivity, extinction ratio, wavelength, light-emitting, light-receiving, current and voltage, to ensure the signal quality, stability and reliability of the transmission.
End Face Testing
Check the end face of the transceivers and keep them clean for more stable data transmission, better performance, and durability.
Various Switch Tests
Every module is quality tested for compatibility in the multi-brand switches environment, guaranteeing flawless operations.