FT11BCS2000 SFP+ 1X1 Cage With Grounding Pin EMI Spring Finger

F-tone FT11BCS2000 1x1 Port SFP+ Cage with EMI Spring Fingers

Engineered to maximize signal integrity and mechanical stability in demanding data center and telecommunications infrastructure, the FT11BCS2000 is a highly durable 1x1 (single-port) SFP+ cage assembly. Designed as a standalone mechanical receptacle, this shielding cage envelops and protects PCB-mounted electrical connectors, providing critical structural alignment and a protective housing for high-speed Small Form-factor Pluggable Plus (SFP+) optical transceivers and direct-attach copper (DAC) cables.

Constructed from a premium Nickel-Plated Copper Alloy, this heavy-duty cage delivers superior structural rigidity and uncompromising resistance to oxidation and corrosion. Featuring dedicated grounding pins and an extreme military-grade operating temperature range of -55°C to 85°C, the FT11BCS2000 guarantees mission-critical mechanical reliability for both climate-controlled enterprise data centers and unconditioned outdoor edge computing enclosures.

Advanced EMI Containment & Grounding

Managing Electromagnetic Interference (EMI) in high-speed chassis configurations is a critical design mandate. The FT11BCS2000 achieves superior electromagnetic compatibility (EMC) through its advanced shielding and grounding construction.

• Active EMI Spring Fingers: Heavy-duty metallic EMI spring fingers surround the perimeter of the port opening. These springs ensure continuous, low-impedance electrical contact with the metallic chassis bezel, aggressively sealing the enclosure against external Radio Frequency Interference (RFI) and safely shunting electrostatic discharge (ESD) to ground.
• Dedicated Grounding Pins: Engineered with specialized through-hole grounding pins that establish a direct, low-inductance path to the motherboard's ground plane, ensuring maximum shielding effectiveness for high-frequency emissions.
• Nickel-Plated Copper Alloy: The premium metal housing acts as a continuous Faraday shield, aggressively containing internal emissions generated by PHY transceivers and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.

Mechanical Design & Wave Solder PCB Integration

Hardware engineers prioritize long-term mechanical reliability alongside high-yield automated manufacturing. The FT11BCS2000 leverages robust Through-Hole Technology (THT) to optimize the printed circuit board (PCB) assembly workflow.

• Through-Hole Solder Stability: Designed for standard wave soldering processes, the solid through-hole pins establish a permanent, metallurgical bond with the PCB. This heavily resists the mechanical stress, physical shock, and thermal cycling associated with frequent transceiver insertions in harsh environments.
• Streamlined Front Panel (No Lightpipes): Designed explicitly without integrated lightpipes, this cage offers a clean, low-interference outer profile. This is highly advantageous for custom faceplate bezels or systems that rely on external, chassis-mounted diagnostic LEDs, reducing internal routing complexity.
• Tray Packaging for Automation: Supplied in standard tray packaging, ensuring component protection during transit and enabling seamless integration into automated factory floor pick-and-place assembly lines.

Typical Applications

Combining robust EMI containment, secure solder integration, and extended thermal resilience (-55°C to 85°C), the FT11BCS2000 is the optimal mechanical housing for high-throughput network architectures:

• Data Center & Enterprise Switching: High-density Top-of-Rack (ToR) switches, core edge routers, and network aggregation devices requiring standalone cage configurations.
• Telecommunications Infrastructure: Broadband access hubs, unconditioned outdoor 5G baseband units (BBUs), and fiber-to-the-x (FTTX) optical line terminals (OLTs).
• Industrial & Edge Computing: Ruggedized industrial Ethernet gateways and micro-data center nodes deployed in extreme manufacturing or energy sector environments.
• Network Security: Next-generation firewalls, intrusion detection systems (IDS), and unified threat management (UTM) hardware demanding aggressive EMI containment.