FT11BCS2050 SFP+ 1x1 Cage With Heat Sink Solder Through Hole

F-tone FT11BCS2050 1x1 Port SFP+ Cage with Heat Sink

Engineered to resolve demanding thermal management and signal integrity challenges in modern data center and telecommunications infrastructure, the FT11BCS2050 is a highly robust 1x1 (single-port) SFP+ cage assembly featuring an integrated heat sink. Designed as a standalone mechanical receptacle, this shielding cage envelops and protects PCB-mounted electrical connectors, providing critical structural alignment and a protective physical housing for high-speed Small Form-factor Pluggable Plus (SFP+) optical transceivers and direct-attach copper (DAC) cables.

Constructed from a premium Nickel-Plated Copper Alloy, this heavy-duty cage delivers superior structural rigidity and uncompromising resistance to oxidation and corrosion. Featuring an extreme military-grade operating temperature range of -55°C to 85°C, the FT11BCS2050 guarantees mission-critical mechanical reliability for both climate-controlled enterprise data centers and unconditioned outdoor edge computing enclosures where robust passive cooling is essential.

Advanced Thermal Management via Integrated Heat Sink

As high-speed optical transceivers scale in bandwidth performance, they generate significant localized thermal loads. The FT11BCS2050 intelligently addresses this by incorporating a precision-engineered riding heat sink directly into the cage architecture.

• Maximized Heat Dissipation: The integrated heat sink mechanism extends the overall cage height to 14.75mm (0.581 inches), providing a substantial thermal mass and increased surface area. This allows cooling air to efficiently sweep heat away from the transceiver module, preventing thermal throttling and extending the lifespan of sensitive internal PHY components.
• Direct Physical Contact: The heat sink assembly maintains direct, spring-loaded physical contact with the inserted SFP+ module, ensuring a highly efficient, low-resistance thermal transfer path from the optic to the ambient chassis airflow.

Typical Applications

Combining aggressive passive thermal management, robust EMI containment, extended thermal resilience (-55°C to 85°C), and a highly reliable solder-mount design, the FT11BCS2050 is the optimal mechanical housing for high-throughput network architectures:

• Data Center & Enterprise Switching: High-density Top-of-Rack (ToR) switches, core edge routers, and network aggregation devices demanding superior heat dissipation for high-power optical modules.
• Telecommunications Infrastructure: Broadband access hubs, 5G baseband units (BBUs), and fiber-to-the-x (FTTX) optical line terminals (OLTs) operating in thermally challenging environments.
• Industrial & Edge Computing: Ruggedized industrial Ethernet switches and micro-data center nodes deployed in extreme temperature environments (-55°C to 85°C) lacking active climate control.
• Network Security: Next-generation firewalls, intrusion detection systems (IDS), and unified threat management (UTM) hardware requiring robust EMI containment and strict thermal regulation.