FTBC02030 SFP+ Cage With Heat Sink EMI Spring Finger Press-Fit Through Hole, Right Angle

FT11BC02030 1x1 SFP+ Cage with Heat Sink | Press-Fit EMI Shielding

The FT11BC02030 is a high-performance, single-port (1x1) SFP+ (Small Form-Factor Pluggable Plus) Cage engineered to securely house 10Gbps optical transceivers. Constructed from precision-stamped, Nickel-plated Copper Alloy, this structural shielding component features a Right Angle, Through-Hole mounting design. Utilizing a Press-Fit (compliant pin) termination method, it allows hardware manufacturers to bypass high-stress wave soldering processes, ensuring a highly reliable, solderless mechanical assembly on complex host motherboards.

Advanced Thermal Management and EMI Containment

Operating 10GBASE-R optical networks generates substantial thermal loads. To mitigate this, the FT11BC02030 integrates a robust top-mounted Heat Sink designed to continuously dissipate heat away from the inserted transceiver module, effectively preventing thermal throttling. Furthermore, the cage is equipped with heavy-duty EMI Spring Fingers around the bezel opening. This ensures superior Electromagnetic Interference (EMI) containment, grounding the chassis panel to block high-frequency RF leakage and maintain pristine signal integrity.

Engineered for Extreme Ruggedized Environments

Surpassing standard industrial thermal specifications, this SFP+ cage is built to operate flawlessly across an extreme temperature range of -55°C to +85°C. This exceptional cold-weather resilience makes it the ultimate mechanical housing for equipment deployed in severe environmental conditions. Typical applications include outdoor 5G telecom base stations, ruggedized edge servers, aerospace communication arrays, and heavy-duty industrial network switches.

Technical Specifications & Structural Features

• Solderless PCB Assembly: Designed with Press-Fit termination pins, drastically reducing thermal stress on the motherboard during manufacturing and lowering overall PCB assembly costs.
• Integrated Active Cooling: Features a high-efficiency heat sink designed to maintain optimal operating temperatures for high-power 10G optical transceivers or Direct Attach Copper (DAC) cables.
• Premium EMI Shielding: Built with robust Copper Alloy and Nickel plating, combined with precision EMI spring fingers to meet stringent FCC/CE RF emission standards.
• Extreme Thermal Resilience: Withstands severe environmental conditions, functioning reliably down to -55°C for specialized military, aerospace, and polar deployment hardware.
• Standardized Matrix: The 1x1 port configuration is supplied in secure Tray Packaging, facilitating smooth and safe handling for high-volume hardware production lines.