TE 1367645-4 SFP Cage with Heat Sink Connector Press-Fit 4 Gb/s

1367645-4, SFP, Cage Assembly, Data Rate (Max) 4 Gb/s, External Springs, SFP, 1 x 1, Pin, Heat Sink Height 4.2 mm [.165 in], DWDM

The 1367645-4 is an industrial-grade 1x1 SFP Cage Assembly with an Integrated Heat Sink, engineered specifically to manage the aggressive thermal loads of specialized pluggable I/O optics. Rated for data rates up to 4 Gb/s, this receptacle provides the critical structural and thermal infrastructure required for legacy 4G Fibre Channel Storage Area Networks (SAN) and high-power telecommunications transport equipment.

The defining architectural feature of the 1367645-4 is its thermal management system, specifically tailored for DWDM (Dense Wavelength Division Multiplexing) transceivers. Because DWDM lasers dissipate significantly more heat than standard short-reach optics, the cage is equipped with a specialized Pin-Style Heat Sink. Unlike traditional extruded longitudinal fins that require strict front-to-back airflow, the pin-grid geometry allows for omnidirectional thermal dissipation, making it highly effective in complex chassis environments with turbulent or cross-directional air currents. Furthermore, the heat sink features a strict 4.2mm (0.165 inch) PCI-class height profile. This low-profile Z-axis clearance ensures the assembly easily fits within the restrictive slot pitch of stacked PCI Express (PCIe) network interface cards without causing structural interference.

Mechanically, the Copper Alloy cage is equipped with heavy-duty External EMI Springs. In deployments where sheet metal faceplates exhibit unpredictable stamping tolerances, these springs actively compress against the bezel to absorb variances. This establishes continuous 360-degree grounding, aggressively containing RF leakage and ensuring strict FCC/CE compliance.

Designed for high-yield manufacturing on robust motherboards, it utilizes a solderless Through-Hole Press-Fit termination. With an extended 3.0mm tail length, it is explicitly optimized for thicker, high-layer-count PCBs (recommended 2.25mm thickness). By eliminating wave soldering, the press-fit architecture preserves the integrity of adjacent high-speed signal vias. Operating reliably from -55°C to +85°C, it is the definitive SFP housing for ruggedized telecom base stations, DWDM transport nodes, and extreme-environment networking cards.