TE 2-2343522-0 zSFP+ Cage Assembly With Integrated Connector 2x2 Port 56 Gb/s

TE 2-2343522-0 2x2 zSFP+ Stacked Receptacle and Cage Assembly with Lightpipes

Engineered to satisfy the ultra-high bandwidth demands of next-generation 400G/800G data center architectures and 5G telecommunications infrastructure, the TE 2-2343522-0 is a premium 2x2 (4-port) stacked zSFP+ cage and receptacle assembly. By organizing four Small Form-factor Pluggable (SFP28 / SFP56) ports into a dense, vertically stacked 2x2 matrix, this assembly empowers hardware architects to radically increase port capacity on standard 1U and 2U networking chassis. Integrating both the mechanical EMI shielding cage and the 80-position electrical receptacles into a single, pre-aligned unit eliminates tolerance stack-up issues and ensures flawless mating for ultra-high-speed transceivers operating up to 56 Gb/s per channel.

Constructed from high-grade Nickel Silver Alloy, this heavy-duty cage assembly delivers superior structural rigidity and intrinsic resistance to oxidation across an extreme military-grade temperature range of -55°C to 105°C. Utilizing an optimized Through-Hole Press-Fit mounting mechanism, the 2-2343522-0 guarantees mission-critical reliability for climate-controlled enterprise data centers, high-performance computing (HPC) environments, and unconditioned outdoor edge computing enclosures.

Integrated Lightpipes for Visual Diagnostics

Providing clear, port-level diagnostic feedback in massive multi-port stacked configurations is a complex mechanical challenge. The 2-2343522-0 intelligently resolves this by incorporating precision-engineered Integrated Lightpipes directly into the cage architecture.

• Comprehensive Port Visibility: These dedicated optical channels efficiently capture light from surface-mounted LEDs located on the PCB and route it directly to the front chassis bezel for both the upper and lower port rows simultaneously.
• Simplified Troubleshooting: Provides network administrators with immediate, unambiguous visual status indicators (such as Link Speed and Network Activity) for all four ports, without compromising the cage’s electromagnetic shielding or requiring complex external LED light-guides.

Advanced EMI Containment via External Springs

Managing Electromagnetic Interference (EMI) in high-density chassis configurations operating at extreme 56 Gb/s PAM4 frequencies is a critical design mandate. The 2-2343522-0 achieves superior electromagnetic compatibility (EMC) through its advanced shielding design.

• External EMI Springs: Heavy-duty metallic EMI springs surround the perimeter of the port openings. These external springs compress directly against the inner edge of the metallic chassis bezel, creating a continuous 360-degree, low-impedance electrical path to ground, aggressively sealing the enclosure against external Radio Frequency Interference (RFI).
• Nickel Silver Shielding: The premium alloy acts as a continuous Faraday shield, aggressively containing internal high-frequency emissions generated by the SFP56 PHY transceivers and ensuring strict compliance with FCC, CE, and CISPR regulatory standards.
• Port-to-Port Isolation: Internal metallic dividers act as physical and electrical barriers, dramatically reducing near-end crosstalk (NEXT) and electromagnetic coupling between adjacent and vertically stacked zSFP+ modules.

Mechanical Design & Automated PCB Integration

Hardware engineers prioritize long-term mechanical reliability alongside high-yield automated manufacturing. The 2-2343522-0 leverages advanced structural technology to optimize the printed circuit board (PCB) assembly workflow.

• Integrated 80-Position Receptacle: Features an integrated 20-pin receptacle per port (80 positions total). Pre-aligning the electrical interfaces within the cage drastically streamlines manufacturing and ensures exact pin-to-pad alignment for critical 56 Gbps signal integrity.
• Press-Fit (Compliant Pin) Technology: The assembly utilizes a solderless Through-Hole Press-Fit mounting style. The compliant pins are driven directly into plated through-holes (PTH) on the PCB, creating a cold-welded, gas-tight mechanical bond that heavily resists vibration, physical shock, and entirely eliminates the thermal stress of secondary wave soldering.

Technical Specifications