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TE 2007464-3 SFP+ Cage With Heat Sink Connector Press-Fit Through Hole Right Angle

TE 2007464-3 SFP+ Cage With Heat Sink Connector Press-Fit Through Hole Right Angle

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TE 2007464-3 1x1 zSFP+ Cage Assembly with 13.5mm Pin Heat Sink

Engineered to resolve extreme thermal and signal integrity challenges in next-generation telecommunications and high-density data center infrastructure, the TE 2007464-3 is a premium 1x1 (single-port) zSFP+ cage assembly. Designed to house high-speed Small Form-factor Pluggable (SFP+ and zSFP+) optical transceivers and direct-attach copper (DAC) cables, this highly durable mechanical receptacle reliably supports data transmission rates up to 16 Gb/s. To aggressively combat the intense localized heat generated by high-frequency 10GbE and 16G Fibre Channel optics, this cage integrates a massive, precision-engineered 13.5mm [0.531 in] pin heat sink, providing superior omnidirectional passive thermal dissipation.

Constructed from a premium Nickel Silver Alloy, this cage assembly delivers intrinsic structural rigidity and outstanding resistance to oxidation across an extreme military-grade temperature range of -55°C to 105°C. Utilizing a highly reliable solderless Through Hole Press-Fit mounting mechanism and an advanced Elastomeric Gasket for EMI containment, this assembly provides hardware architects with a mission-critical physical layer housing for core routers, ruggedized edge computing enclosures, and high-performance networking chassis.

TE 2007464-3 Cross-Reference & BOM Optimization

Developed as an exact form-fit-function compatible replacement for the TE Connectivity 2007464-3, this zSFP+ cage empowers hardware architects and procurement teams to secure their supply chains and mitigate component shortages. Delivering an identical PCB footprint, equivalent thermal performance, and matched mechanical characteristics, it serves as a seamless drop-in alternative. It integrates flawlessly into high-speed, automated assembly lines without the need for costly printed circuit board (PCB) redesigns or mechanical chassis alterations.

Typical Applications

Combining 16 Gb/s bandwidth support, massive omnidirectional pin-style thermal management, Elastomeric Gasket EMI sealing, and extreme temperature resilience, this 1x1 zSFP+ cage assembly is the definitive physical layer solution for high-performance hardware:

  • Data Center Infrastructure: 10GbE / 16GFC Top-of-Rack (ToR) switches, aggregation routers, and high-density blade servers supporting Belly-to-Belly configurations with turbulent internal airflow.
  • Telecommunications & Edge: 5G baseband processing units (BBUs), optical transport network (OTN) equipment, and ruggedized outdoor telecom cabinets lacking active climate control.
  • Storage Area Networks (SAN): 16G Fibre Channel enterprise storage arrays and high-throughput host bus adapters (HBAs) requiring robust, multi-directional thermal dissipation and dust sealing.
  • Defense & Aerospace: Mission-critical communication hubs requiring military-grade temperature tolerances (-55°C to 105°C) and vibration-resistant press-fit mountings.

Technical Specifications

F-tone Part Number: 2007464-3 Part Status: Active
Connector Style: Cage with Heat Sink Connector Type: SFP+ (Small Form-factor Pluggable Plus)
Data Rate (Max)(Gb/s): 16 GB/S Mounting Type: Through Hole, Right Angle
Termination Method: Press-Fit Features: EMI Shielded, Thermal Management
Port Matrix Configuration: 1x1 Ports Number of Ports: 1
Connector Mounting Type: Board Mount Heat Sink Type: Pin (Height: 6.5 mm / 0.256 in)
Operating Temperature: -55°C to 105°C (Extended Grade) Pluggable I/O Applications: SFP+ Stacked Belly-to-Belly
Circuit Application: Signal EMI Containment Feature: External EMI Springs
Included Lightpipe: NO Cage Material: Nickel Silver Alloy
PCB Thickness (Recommended): 2.25mm [0.089in] Tail Length: 2.05mm [0.081in]

Contact us.

For any inquiries, please feel free to contact us. We reply within 24 hours. 

📧 Email: una@f-tone.com 

📱 Mobile / WhatsApp / WeChat: +86 177 6116 3895

Important Notice

Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by F-tone Networks before they become applicable to any particular order or contract. In accordance with the F-tone Networks policy of continuous improvement specifications may change without notice.

The publication of information in this data sheet does not imply freedom from patent or other protective rights of F-tone Networks or others. Further details are available from any F-tone Networks sales representative.

Power and Wavelength Testing

Test the signal delivering strength and wavelength, to ensure the signal decoding capacity of the receiver, and the wavelength remains consistent from the transmitter to the receiver.

Power and Wavelength Testing

Traffic Testing

Test the bit error rate and packet loss rate, to make them meet the corresponding standards and ensure the performance of transceivers.

Traffic Testing

Optical Performance Testing

Test the transceivers' eye diagram situation, receiving sensitivity, extinction ratio, wavelength, light-emitting, light-receiving, current and voltage, to ensure the signal quality, stability and reliability of the transmission.

Optical Performance Testing

End Face Testing

Check the end face of the transceivers and keep them clean for more stable data transmission, better performance, and durability.

End Face Testing

Various Switch Tests

Every module is quality tested for compatibility in the multi-brand switches environment, guaranteeing flawless operations.

Various Switch Tests

About F-tone Networks

F-tone Networks is now a world leader in development of optical transceivers and provide a wide range of high-speed optical solutions for optical communication networking, especially for AI, Data Center, enterprise data networking, Industry, aerospace, mining, shipbuilding, railway, metro, long haul transport networking, and mobile access networking applications
F-tone Networks invested in foundational photonics technologies and extensive product development and engineering with global presence in many area also.