TE 2170167-1 SFP Cage Ganged (1x4) Connector Press-Fit Through Hole External Springs 4 Gbs

2170167-1: 1x4 SFP, SFP+ & zSFP+ Ganged Cage Assembly with External Springs (-55°C to 105°C)

Engineered for next-generation network hardware operating in punishing environments, the 2170167-1 is a highly durable 1x4 (4-port) ganged cage assembly. Designed to physically accommodate a versatile range of transceivers—including standard SFP, SFP+, and zSFP+ modules—this robust cable-to-board interconnect solution provides a unified mechanical housing for multi-port networking interfaces. Rated for physical data throughput environments up to 4 Gb/s, it allows data center architects and hardware designers to maximize front-panel density while ensuring strict mechanical alignment for Pluggable I/O modules.

A major differentiator of the 2170167-1 is its exceptional thermal endurance, boasting an extended operating temperature range of -55°C to 105°C. Constructed from premium Nickel Silver and featuring a reliable Through Hole Press-Fit mounting mechanism, this cage assembly delivers unmatched structural rigidity and corrosion resistance without the need for secondary PCB reflow soldering.

High-Density Ganged Architecture & Multi-MSA Compatibility

The ganged 1x4 port matrix significantly optimizes printed circuit board (PCB) real estate by consolidating four independent interfaces into one contiguous block. While the cage mechanically supports advanced SFP+ and zSFP+ pluggable modules, its mechanical shielding and port dimensions make it an ideal housing for high-reliability Gigabit Ethernet (1GbE), 2.5GbE, and 4G Fibre Channel (4GFC) topologies. The use of a high-grade Nickel Silver alloy ensures intrinsic resistance to oxidation and superior long-term mechanical stability.

Advanced EMI Containment via External Springs

Managing Electromagnetic Interference (EMI) is a critical requirement for high-density, multi-port chassis designs. The 2170167-1 utilizes heavy-duty External EMI Springs to achieve superior electromagnetic compatibility (EMC).

• Chassis Grounding: The external metallic springs compress against the inner edge of the chassis bezel, creating a continuous 360-degree, low-impedance electrical path to ground.
• High-Frequency Shielding: Aggressively blocks external Radio Frequency Interference (RFI) while containing internal high-frequency emissions, ensuring the host hardware easily passes strict FCC, CE, and CISPR regulatory testing.
• Port-to-Port Isolation: Internal Faraday shielding between the four ganged ports dramatically reduces near-end crosstalk (NEXT) between adjacent transceivers.

Hardware Layout & Press-Fit PCB Integration

For hardware engineers, the 2170167-1 streamlines high-volume manufacturing by eliminating thermal stress on the PCB during assembly.

• Compliant Pin Technology: Features a solderless Press-Fit mounting style. The cage pins press directly into plated through-holes (PTH), establishing a gas-tight mechanical bond that withstands heavy vibration and mechanical shock.
• Optimized for Standard PCBs: Designed with a 2.05mm [0.081in] tail length, making it perfectly optimized for standard 1.5mm [0.059in] thick printed circuit boards.
• Extreme Thermal Resilience: The 105°C upper temperature limit makes this assembly virtually immune to the thermal degradation commonly found in poorly ventilated edge computing enclosures or ruggedized military hardware.

Typical Applications

With its 105°C thermal rating, multi-MSA mechanical compatibility, and press-fit assembly, the 2170167-1 SFP cage is the definitive choice for extreme-environment networking infrastructure:

• Defense & Aerospace: Ruggedized military communication hubs and avionics systems subjected to massive temperature fluctuations.
• Industrial Automation: Factory-floor Industrial Ethernet (IE) switches and Programmable Logic Controllers (PLCs) located near high-heat machinery.
• Telecommunications (OSP): Outside Plant (OSP) broadband aggregation routers, 5G base stations, and FTTH cabinets lacking active climate control.
• Edge Computing: High-density I/O micro-data centers deployed in unconditioned or harsh edge environments.