TE Connectivity 2198224-1 Compatible SFP+ 1x2 Cage Assembly Technical Overview
The TE Connectivity 2198224-1 is a 1x2 ganged SFP+ cage assembly with integrated 4.2mm pin heat sink and conductive elastomeric EMI gasket designed for TE Connectivity 2198224-1 compatible applications in 10Gb/s Ethernet and 16Gb/s Fibre Channel platforms. Featuring solderless press-fit PCB mounting, a nickel silver alloy housing, and peripheral elastomeric gasket shielding, it provides effective heat dissipation, structural port retention, and seam-free grounding for enterprise switches, SAN storage, and telecom enclosures.
- Mechanical Form Factor: 1x2 Ganged Single-Row 2-Port SFP+ Cage Assembly with pre-installed 4.2mm [.165 in] pin heat sink (Lightpipe-free profile).
- Signal Ecosystem Support: Engineered for SFP+ Enhanced optical transceivers and Direct Attach Copper (DAC) cables operating up to 16 Gb/s (SFF-8431, 10GbE, and 16G Fibre Channel).
- Board Mount Technology: Solderless Through-Hole Press-Fit termination with 2.05mm tail length, optimized for standard 1.5mm [.059 in] PCB substrates.
- Alternative Sourcing Option: Multi-source engineering options are available to support secondary sourcing strategies, BOM cost optimization, and supply chain flexibility.
How to Select and Verify an SFP+ Cage Assembly Replacement
When evaluating or sourcing 1x2 ganged SFP+ cage assemblies with elastomeric EMI gaskets for new line card designs or supply chain diversification, hardware engineers should verify the following core parameters:
- EMI Shielding Type (Elastomeric Gasket vs External Springs): Confirm whether your chassis bezel cutout design is optimized for conductive elastomeric gaskets (which provide continuous gapless sealing and environmental dust protection) or metallic spring fingers.
- Recommended PCB Board Thickness: Ensure the 2.05mm tail length matches your target motherboard thickness (TE 2198224-1 is optimized for standard 1.5mm PCBs).
- Heat Sink Height & Thermal Budget: Verify that a 4.2mm [.165 in] pin heat sink height fits within your chassis vertical clearance while providing sufficient thermal dissipation for your target transceivers.
- Port Density & Panel Cutout: Ensure a 1x2 side-by-side (ganged) footprint aligns with front-panel bezel cutouts and host board SMT connector contact pitch.
- Mechanical Drawing Verification: Check grounding gasket compression tolerances, press-fit hole layouts, and pin locations against official engineering drawings when qualifying alternative suppliers.
| Part Number: | 2198224-1 | Part Status | Active |
| Connector Style | Cage, Ganged (1 x 2) with Heat Sink | Connector Type | SFP+ |
| Data Rate (Max)(Gb/s) | 16 | Mounting Type | Through Hole, Right Angle |
| Termination | Press-Fit | Features | EMI Shielded |
| Port Matrix Configuration | 1x2 Ports | Number of Ports | 2 |
| Heat Sink Height | 4.2mm[.165in] | Connector Mounting Type | Board Mount |
| Operating Temperature Range | -55 – 105°C | Pluggable I/O Applications | SFP+ Enhanced |
| Circuit Application | Signal | EMI Containment Feature Type | Elastomeric Gasket |
| Included Lightpipe | NO | Cage Material | Nickel Silver Alloy |
| PCB Thickness (Recommended) | 1.5mm[.059in] | Tail Length | 2.05mm[.081in] |
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Important Notice
Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by F-tone Networks before they become applicable to any particular order or contract. In accordance with the F-tone Networks policy of continuous improvement specifications may change without notice.
The publication of information in this data sheet does not imply freedom from patent or other protective rights of F-tone Networks or others. Further details are available from any F-tone Networks sales representative.
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Power and Wavelength Testing
Test the signal delivering strength and wavelength, to ensure the signal decoding capacity of the receiver, and the wavelength remains consistent from the transmitter to the receiver.
Traffic Testing
Test the bit error rate and packet loss rate, to make them meet the corresponding standards and ensure the performance of transceivers.
Optical Performance Testing
Test the transceivers' eye diagram situation, receiving sensitivity, extinction ratio, wavelength, light-emitting, light-receiving, current and voltage, to ensure the signal quality, stability and reliability of the transmission.
End Face Testing
Check the end face of the transceivers and keep them clean for more stable data transmission, better performance, and durability.
Various Switch Tests
Every module is quality tested for compatibility in the multi-brand switches environment, guaranteeing flawless operations.