TE Connectivity 2198224-3 Compatible SFP+ 1x2 Cage Assembly Technical Overview
The TE Connectivity 2198224-3 is a 1x2 ganged SFP+ cage assembly with an integrated 9.1mm pin heat sink and conductive elastomeric EMI gasket designed for TE Connectivity 2198224-3 compatible applications in high-power 10Gb/s Ethernet and 16Gb/s Fibre Channel systems. Featuring solderless press-fit PCB mounting and a nickel silver body, it combines enhanced thermal dissipation, gapless panel ground sealing, and structural module retention for enterprise storage arrays, core switches, and telecom infrastructure.
- Mechanical Form Factor: 1x2 Ganged Single-Row 2-Port SFP+ Cage Assembly with pre-installed 9.1mm [.358 in] pin heat sink (Lightpipe-free profile).
- Signal Ecosystem Support: Engineered for high-power SFP+ Enhanced optical transceivers, 10GBASE-T copper RJ45 modules, and extended-reach optics up to 16 Gb/s (SFF-8431, 10GbE, and 16G Fibre Channel).
- Board Mount Technology: Solderless Through-Hole Press-Fit termination with 2.05mm tail length, optimized for standard 1.5mm [.059 in] PCB substrates.
- Alternative Sourcing Option: Multi-source engineering options are available to support secondary sourcing strategies, BOM cost optimization, and supply chain flexibility.
TE Connectivity 2198224-3 SFP+ Cage Assembly Product Overview
TE Connectivity 2198224-3 is a 1x2 ganged SFP+ Enhanced cage assembly featuring an integrated 9.1mm [.358 in] pin heat sink, a conductive elastomeric EMI gasket, and press-fit PCB mounting. Designed for thermal-intensive I/O interfaces in enterprise storage, core switching, and telecom equipment, this 2-port assembly provides passive thermal cooling for high-wattage transceivers, gapless panel grounding, and mechanical module retention across extended operating temperatures (-55°C to +105°C).
Key Benefits of TE Connectivity 2198224-3 SFP+ Cage Assembly
- Enhanced Passive Thermal Dissipation: Pre-assembled 9.1mm [.358 in] pin heat sink increases surface cooling area, efficiently conducting heat away from power-intensive 10G/16G transceivers and DWDM optical modules.
- Conductive Elastomeric EMI Gasket Shielding: Continuous elastomeric gasket provides a seamless, gap-free perimeter ground seal against chassis bezel cutouts, offering superior high-frequency EMI containment and environmental dust protection.
- High-Density Dual-Port Integration: 1x2 ganged architecture consolidates two SFP+ Enhanced ports into a unified housing, optimizing front-panel port density.
- Standard 1.5mm PCB Substrate Matching: Tailored for standard 1.5mm [.059 in] motherboard thickness with 2.05mm press-fit compliant tails for optimal board retention and pin normal force.
- 16 Gb/s High-Speed Capability: Fully compatible with 10GbE, 8G/16G Fibre Channel (FC), and high-frequency CPRI wireless transport protocols.
- Multi-Source Availability: Industry-standard mechanical design enables secondary sourcing strategies to improve supply chain flexibility, lead-time management, and BOM optimization.
| Part Number | 2198224-3 | Part Status | Active |
| Connector Style | Cage, Ganged (1 x 2) with Heat Sink | Connector Type | SFP+ |
| Data Rate (Max)(Gb/s) | 16 | Mounting Type | Through Hole, Right Angle |
| Termination | Press-Fit | Features | EMI Shielded |
| Port Matrix Configuration | 1x2 Ports | Number of Ports | 2 |
| Heat Sink Height | 9.1mm[.358in] | Connector Mounting Type | Board Mount |
| Operating Temperature Range | -55 – 105°C | Pluggable I/O Applications | SFP+ Enhanced |
| Circuit Application | Signal | EMI Containment Feature Type | Elastomeric Gasket |
| Included Lightpipe | NO | Cage Material | Nickel Silver |
| PCB Thickness (Recommended) | 1.5mm[.059in] | Tail Length | 2.05mm[.081in] |
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Important Notice
Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by F-tone Networks before they become applicable to any particular order or contract. In accordance with the F-tone Networks policy of continuous improvement specifications may change without notice.
The publication of information in this data sheet does not imply freedom from patent or other protective rights of F-tone Networks or others. Further details are available from any F-tone Networks sales representative.
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Power and Wavelength Testing
Test the signal delivering strength and wavelength, to ensure the signal decoding capacity of the receiver, and the wavelength remains consistent from the transmitter to the receiver.
Traffic Testing
Test the bit error rate and packet loss rate, to make them meet the corresponding standards and ensure the performance of transceivers.
Optical Performance Testing
Test the transceivers' eye diagram situation, receiving sensitivity, extinction ratio, wavelength, light-emitting, light-receiving, current and voltage, to ensure the signal quality, stability and reliability of the transmission.
End Face Testing
Check the end face of the transceivers and keep them clean for more stable data transmission, better performance, and durability.
Various Switch Tests
Every module is quality tested for compatibility in the multi-brand switches environment, guaranteeing flawless operations.