TE Connectivity 2198230-1 Compatible SFP+ 1x2 Cage Assembly Technical Overview
The TE Connectivity 2198230-1 is a 1x2 ganged SFP+ cage assembly with integrated 4.2mm pin heat sink designed for TE Connectivity 2198230-1 compatible applications in high-density 10Gb/s Ethernet and 16Gb/s Fibre Channel platforms. Featuring solderless press-fit PCB mounting, a nickel silver alloy body, and external metallic EMI spring shielding, it delivers thermal dissipation, structural module retention, and low transfer impedance shielding for enterprise switches, SAN storage, and telecom equipment.
- Mechanical Form Factor: 1x2 Ganged Single-Row 2-Port SFP+ Cage Assembly with pre-installed 4.2mm [.165 in] pin heat sink (Lightpipe-free profile).
- Signal Ecosystem Support: Engineered for SFP+ Enhanced optical transceivers and Direct Attach Copper (DAC) cables operating up to 16 Gb/s (SFF-8431, 10GbE, and 16G Fibre Channel).
- Board Mount Technology: Solderless Through-Hole Press-Fit termination with 2.05mm tail length, specifically tailored for thicker 2.25mm [.089 in] enterprise PCB substrates.
- Alternative Sourcing Option: Multi-source engineering options are available to support secondary sourcing strategies, BOM cost optimization, and supply chain flexibility.
TE Connectivity 2198230-1 SFP+ Cage Assembly Product Overview
TE Connectivity 2198230-1 is a 1x2 ganged SFP+ Enhanced cage assembly featuring an integrated 4.2mm pin heat sink, nickel silver alloy construction, and press-fit PCB mounting. Designed for high-power pluggable modules in enterprise storage arrays, core routers, and cloud switching fabrics, this 2-port assembly provides passive thermal cooling, mechanical retention, and perimeter EMI shielding across extended operating temperatures.
Key Benefits of TE Connectivity 2198230-1 SFP+ Cage Assembly
- Integrated Thermal Dissipation: Pre-assembled 4.2mm pin heat sink improves thermal airflow contact, efficiently conducting heat away from high-power 10G/16G transceivers without requiring custom chassis cooling attachments.
- High-Density Dual-Port Integration: 1x2 ganged architecture consolidates two SFP+ Enhanced ports into a single housing, optimizing front-panel slot space on high-density line cards.
- 16 Gb/s High-Speed Performance: Fully compatible with 10GbE, 8G/16G Fibre Channel (FC), and high-frequency CPRI wireless transport protocols.
- Robust EMI Shielding: External perimeter spring gaskets establish continuous electrical contact against chassis bezel cutouts to control high-frequency radiated emissions.
- Heavy-Duty PCB Substrate Mounting: 2.05mm press-fit tails provide reliable mechanical insertion and normal contact force in thick 2.25mm multi-layer circuit boards.
- Multi-Source Availability: Industry-standard mechanical footprint enables secondary sourcing strategies to improve supply chain resilience, lead-time management, and BOM optimization.
| Part Number | 2198230-1 | Part Status | Active |
| Connector Style | Cage, Ganged (1 x 2) with Heat Sink | Connector Type | SFP+ |
| Data Rate (Max)(Gb/s) | 16 | Mounting Type | Through Hole, Right Angle |
| Termination | Press-Fit | Features | EMI Shielded |
| Port Matrix Configuration | 1x2 Ports | Number of Ports | 2 |
| Number of Rear EONs per Port Column | - | Connector Mounting Type | Board Mount |
| Operating Temperature Range | -55 – 105°C | Pluggable I/O Applications | SFP+ Enhanced |
| Circuit Application | Signal | EMI Containment Feature Type | External Springs |
| Included Lightpipe | NO | Cage Material | Nickel Silver Alloy |
| PCB Thickness (Recommended) | 2.25mm[.089in] | Tail Length | 2.05mm[.081in] |
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Important Notice
Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by F-tone Networks before they become applicable to any particular order or contract. In accordance with the F-tone Networks policy of continuous improvement specifications may change without notice.
The publication of information in this data sheet does not imply freedom from patent or other protective rights of F-tone Networks or others. Further details are available from any F-tone Networks sales representative.
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Power and Wavelength Testing
Test the signal delivering strength and wavelength, to ensure the signal decoding capacity of the receiver, and the wavelength remains consistent from the transmitter to the receiver.
Traffic Testing
Test the bit error rate and packet loss rate, to make them meet the corresponding standards and ensure the performance of transceivers.
Optical Performance Testing
Test the transceivers' eye diagram situation, receiving sensitivity, extinction ratio, wavelength, light-emitting, light-receiving, current and voltage, to ensure the signal quality, stability and reliability of the transmission.
End Face Testing
Check the end face of the transceivers and keep them clean for more stable data transmission, better performance, and durability.
Various Switch Tests
Every module is quality tested for compatibility in the multi-brand switches environment, guaranteeing flawless operations.