TE 2246040-1 SFP+ Micro Receptacle with Cage Press-Fit Through Hole 10 Gbs

TE 2246040-1 1x1 Micro SFP+ Receptacle and Cage Assembly

Engineered to maximize faceplate I/O density in ultra-compact networking devices, the TE 2246040-1 is a highly integrated 1x1 (single-port) Micro SFP+ cage and receptacle assembly. Purpose-built for the Micro SFP form factor, this advanced interconnect solution requires significantly less printed circuit board (PCB) real estate than standard SFP+ components, while still reliably supporting 10 Gigabit Ethernet (10GbE) data transmission rates up to 10 Gb/s. By integrating both the mechanical EMI shielding cage and the 22-position electrical receptacle into a single, pre-aligned unit, hardware architects can radically streamline manufacturing and eliminate tolerance stack-up issues.

Constructed from a premium Copper Alloy, this heavy-duty assembly delivers superior structural rigidity, high electrical conductivity, and robust mechanical durability across a military-grade temperature range of -55°C to 105°C. Utilizing a highly reliable solderless Through Hole Press-Fit mounting mechanism, the 2246040-1 provides a mission-critical physical layer housing for ultra-dense edge routers, ruggedized industrial switches, and high-performance telecom equipment.

Micro SFP+ Architecture & Integrated Receptacle

The Micro SFP+ form factor is a foundational mechanical configuration for hardware designs where standard SFP+ cages are simply too large for the available faceplate clearance.

• Integrated 22-Position Receptacle: Features an integrated 22-pin electrical interface directly within the cage. Pre-aligning the electrical connector with the mechanical housing drastically streamlines the PCB assembly workflow and ensures exact pin-to-pad alignment for flawless 10 Gbps signal integrity.
• Ultra-Compact Footprint: The Micro SFP footprint reduces the physical footprint compared to standard SFP+ ports, enabling hardware engineers to pack more high-speed optical interfaces into 1U and sub-1U chassis designs.
• Streamlined Front Panel (No Lightpipes): Designed explicitly without integrated lightpipes, this cage offers a clean, unobstructed outer profile, reducing internal trace routing complexity for applications utilizing external, chassis-mounted diagnostic LEDs.

  Typical Applications

  Combining 10 Gb/s performance, an ultra-compact Micro SFP form factor, integrated electrical receptacles, and extreme thermal tolerance (-55°C to 105°C), the 2246040-1 is the optimal interconnect housing for space-constrained, high-throughput network architectures:

  • Defense & Aerospace: Ruggedized, miniaturized military communication hubs and avionics systems subjected to massive temperature fluctuations and intense mechanical vibration.
  • Telecommunications Infrastructure: Compact 5G small cells, unconditioned outdoor baseband units (BBUs), and highly dense optical network terminals (ONTs).
  • Data Center & Enterprise Edge: Ultra-dense 10GbE edge switches, compact routers, and specialized network security appliances requiring maximum faceplate port density.
  • Industrial & Edge Computing: Hardened industrial Ethernet gateways and micro-data center nodes deployed in harsh manufacturing or energy sector environments where physical space is highly restricted.