TE 2315853-2 OSFP Cage Ganged (1 x 4) Connector Press-Fit Through Hole Right Angle

Key Benefits of TE Connectivity 2315853-2 OSFP Cage Assembly

• Double-Sided (Belly-to-Belly) Slot Density Optimization: Specialized press-fit pin geometry allows cages to be mounted directly opposite each other on top and bottom PCB surfaces, doubling total line card port count in 1RU/2RU switch chassis.
• Ultra-High 1x4 Quad-Port Density (Up to 3.2 Tbps Aggregate Bandwidth per Cage): Consolidates four 800G OSFP ports into a single integrated 1x4 housing, delivering up to 6.4 Tbps total slot throughput in belly-to-belly line card layouts.
• Lightpipe-Free Unobstructed Airflow Envelope: Flat top profile eliminates lightpipe channels, maximizing vertical clearance for custom riding heatsinks, liquid cooling cold plates, or chassis forced airflow.
• High-Speed Optical Interface Integration: Supports next-generation OSFP optical transceivers, Active Optical Cables (AOCs), and Direct Attach Copper (DAC) interconnects used in 400G and 800G networking platforms.
• Advanced EMI Containment for 112G PAM4: Heavy-duty metallic cage construction and perimeter EMI spring gasket contacts help minimize electromagnetic leakage around pluggable interfaces at high Nyquist frequencies (28 GHz).
• Multi-Source Availability: Industry-standard footprint allows deployment alongside compatible replacement alternatives from qualified suppliers like LINK-PP for BOM cost optimization.

1x4 OSFP Cage Architecture & Belly-to-Belly MSA Compliance

Designed around OSFP MSA mechanical requirements (Rev 4.0/5.0), the TE Connectivity 2315853-2 is a 1x4 ganged (four side-by-side ports) OSFP cage assembly engineered specifically for double-sided PCB board designs. It serves as the physical chassis foundation required to house high-speed 400G (8x50G PAM4) and 800G (8x100G PAM4) optical transceivers, AOCs, and DAC interconnects on high-density line cards.

Double-Sided PCB Mounting & Signal Integrity Optimization

In belly-to-belly line card architectures, two 1x4 OSFP cages share a single motherboard, sitting directly back-to-back. The 2315853-2 features staggered press-fit tail lengths and precise pin clearance zones that prevent pin collision inside shared plated through-holes (PTH). This dual-sided layout doubles front-panel bandwidth to 6.4 Tbps per line card width while maintaining strict 100Ω differential impedance matching and channel insertion loss limits under IEEE 802.3ck specifications.

EMI Shielded OSFP Cage Design for High-Speed 112G PAM4 Applications

High-speed OSFP interfaces supporting 112Gb/s PAM4 per-lane signaling require careful electromagnetic compatibility (EMC) design and mechanical shielding to control radiated emissions and signal integrity risks.

360-Degree Active Metallic EMI Spring Gaskets

The TE Connectivity 2315853-2 features heavy-duty, highly resilient metallic EMI gasket springs fitted around the entire outer perimeter of all four module port openings. When integrated into the chassis front panel cutout, these springs compress firmly against the metallic bezel, establishing a continuous, low-impedance grounding interface around the module openings to improve EMI containment performance.

High-Frequency Shielding Structure

Constructed from a high-conductivity copper alloy with nickel plating, the solid metallic housing functions as an effective EMI shielding structure. It contains internal high-frequency noise generated by optoelectronic components while shielding board-level differential traces from external electromagnetic fields, supporting system-level EMC design requirements for equipment targeting FCC and CE regulatory environments.

Press-Fit OSFP Cage Features and PCB Assembly Integration

To support automated, high-yield manufacturing on dense double-sided motherboards, the 2315853-2 is engineered with precision mechanical press-fit pins.

Solderless Compliant Pin Press-Fit Integration

Equipped with precision compliant press-fit pins, the cage mounts onto the host PCB via mechanical insertion into plated through-holes (PTH). This Through-Hole Technology (THT) avoids additional solder reflow exposure on the PCB substrate, reduces exposure to solder-related thermal stress, and simplifies board repairability during dual-sided assembly.

Thermal Management and Operating Temperature Reliability

Built to endure demanding environmental conditions, the 2315853-2 retains structural integrity and pin contact normal force across an extended operating temperature range of -55°C to +85°C [-67°F to +185°F]. Its low-profile lightpipe-free profile maximizes vertical clearance above the cage, accommodating customized riding heatsinks, heat pipes, or direct-to-chip liquid cooling cold plates necessary for managing high-wattage 800G optical modules (up to 14W–20W per port) in belly-to-belly configurations.

Target Applications: AI Data Centers, Hyperscale Fabrics and Telecom Networks

Combining OSFP MSA mechanical compliance, EMI shielding effectiveness, double-sided belly-to-belly mounting, and press-fit durability, the TE Connectivity 2315853-2 supports mission-critical deployments across advanced networking architectures:

• AI / GPU Compute Networks: Used in AI/HPC supercomputing platforms (e.g., NVIDIA Quantum/Spectrum fabrics, GPU clusters) requiring double-sided 800G OSFP line cards for maximum slot bandwidth.
• Hyperscale 400G/800G Data Center Fabrics: Optimized for Top-of-Rack (ToR) switches, spine routers, and optical switching fabrics demanding continuous transceiver insertion durability and dual-sided board density.
• Carrier-Grade Telecom Infrastructure: Suitable for deployment in 5G mobile backhaul aggregation routers, Optical Transport Networks (OTN), and unconditioned edge compute enclosures.