TE Connectivity 2342933-2 Compatible 1x1 QSFP-DD Cage Technical Overview
The TE Connectivity 2342933-2 is an industry-standard 1x1 single-port QSFP-DD (Double Density) cage assembly featuring an integrated 6.5mm SAN/Networking riding heat sink designed for TE Connectivity 2342933-2 compatible applications in 200G and 400G high-speed pluggable optical networking platforms. Featuring a heavy-duty stainless steel housing, solderless press-fit PCB mounting, and 360-degree metallic EMI spring gaskets, it provides structural port retention, passive transceiver thermal cooling, low transfer impedance panel grounding, and backward compatibility for hyperscale data center switches, SAN directors, and telecom infrastructure.
- Mechanical Form Factor: 1x1 Single-Port QSFP-DD (Quad Small Form-factor Pluggable Double Density) Cage Assembly with pre-installed 6.5mm [.256 in] SAN/Networking heat sink (Lightpipe-free low profile).
- Signal Ecosystem Support: Engineered for 8-channel high-speed interfaces supporting 200G (8x28G NRZ) and 400G (8x56G PAM4) Ethernet compliant with IEEE 802.3bs and QSFP-DD MSA specifications.
- Material Construction: High-rigidity Stainless Steel cage body offering exceptional mechanical strength and corrosion protection under heavy cable strain.
- Board Mount Technology: Solderless Through-Hole Press-Fit connection with 1 rear Eye-of-Needle (EON) pin per port column for reliable PCB retention.
- Alternative Sourcing Option: Footprint-compatible alternative options are available from LINK-PP to support multi-source procurement strategies and supply chain flexibility.
TE Connectivity 2342933-2 QSFP-DD Cage Assembly Product Overview
TE Connectivity 2342933-2 is a 1x1 single-port QSFP-DD cage assembly featuring an integrated 6.5mm [.256 in] SAN/Networking heat sink, 360-degree metallic EMI shielding springs, stainless steel construction, and press-fit PCB mounting. Designed for 200G and 400G optical transceivers in cloud switching routers, SAN storage arrays, and high-density line cards, this single-port assembly provides passive thermal dissipation, robust mechanical module retention, and low transfer impedance EMI containment across extended operating temperatures (-55°C to +85°C).
Key Benefits of TE Connectivity 2342933-2 QSFP-DD Cage Assembly
- Integrated 6.5mm Passive Thermal Cooling: Pre-assembled 6.5mm [.256 in] height SAN/Networking riding heatsink efficiently conducts heat away from high-power 200G/400G transceivers (up to 12W–14W per port) into chassis forced airflow.
- 8-Channel Double-Density Bandwidth (200G / 400G): Doubles port density compared to standard 4-lane QSFP cages by accommodating an 8-lane electrical interface supporting PAM4 and NRZ signaling formats.
- Heavy-Duty Stainless Steel Construction: High structural rigidity prevents cage wall deformation under heavy DAC/AOC cable strain and repeated module insertion/extraction cycles.
- Backward Compatibility with Legacy QSFP Modules: Accommodates standard 40G and 100G QSFP transceivers in addition to next-generation QSFP-DD optical engines.
- Advanced EMI Containment: Perimeter metallic EMI spring gaskets establish continuous grounding against chassis bezel cutouts, minimizing electromagnetic leakage around pluggable interfaces.
- Solderless Press-Fit Manufacturing Flexibility: Precision compliant press-fit pins simplify board assembly, increase manufacturing yields, and avoid additional solder reflow thermal exposure on multi-layer PCB substrates.
1x1 QSFP-DD Architecture & 200G/400G MSA Compliance
Designed around QSFP-DD MSA specifications and IEEE 802.3bs standards, the TE Connectivity 2342933-2 is a single-port (1x1) QSFP-DD cage assembly constructed from stainless steel. It serves as the physical chassis foundation required to house high-speed 200G (8x28G NRZ) and 400G (8x56G PAM4) optical transceivers, AOCs, and Direct Attach Copper (DAC) interconnects.
Riding Heat Sink Thermal Management & Signal Integrity
The integrated 6.5mm [.256 in] SAN/Networking riding heatsink features a clip-on spring mechanism that maintains direct physical pressure against the top surface of inserted QSFP-DD transceivers. This direct thermal contact minimizes thermal resistance, allowing active optical modules to maintain optimal operating temperatures during continuous 400G transmission. The cage structure maintains strict 100Ω differential impedance matching, minimizing channel skew across all 8 high-speed differential lanes.
EMI Shielded QSFP-DD Cage Design with External Springs
High-speed QSFP-DD interfaces operating at 56Gb/s PAM4 signaling rates (28 GHz Nyquist frequency) require careful electromagnetic compatibility (EMC) design and mechanical shielding to control radiated emissions and signal integrity risks.
360-Degree Active Metallic EMI Spring Gaskets
The TE Connectivity 2342933-2 features heavy-duty, highly resilient metallic EMI gasket springs fitted around the entire outer perimeter of the module port opening. When integrated into the chassis front panel cutout, these springs compress firmly against the metallic bezel, establishing a continuous, low-impedance grounding interface around the module opening to improve EMI containment performance.
High-Frequency Stainless Steel Shielding Structure
Constructed from a solid stainless steel body, the metal housing functions as an effective EMI shielding structure. It contains internal high-frequency noise generated by optoelectronic components while shielding board-level differential traces from external electromagnetic fields, supporting system-level EMC design requirements for equipment targeting FCC Class A and CE regulatory compliance.
Press-Fit Assembly Features & 1 Rear EON Pin Configuration
To support automated, high-yield manufacturing on dense motherboard layouts, the 2342933-2 is engineered with precision mechanical press-fit pins, including 1 rear Eye-of-Needle (EON) pin per port column.
Solderless Compliant Pin Press-Fit Integration
Equipped with precision compliant press-fit pins, the cage mounts onto the host PCB via mechanical insertion into plated through-holes (PTH). This Through-Hole Technology (THT) avoids additional solder reflow exposure on the PCB substrate, reduces exposure to solder-related thermal stress, and simplifies board repairability.
Target Applications: Enterprise SAN Directors, 400G Switches, and Telecom
Combining QSFP-DD MSA mechanical compliance, EMI shielding effectiveness, stainless steel durability, and an integrated 6.5mm heatsink, the TE Connectivity 2342933-2 supports mission-critical deployments across advanced networking architectures:
- Hyperscale 200G/400G Data Center Switches: Optimized for Top-of-Rack (ToR) switches, spine routers, and optical switching fabrics demanding continuous transceiver insertion durability and passive thermal cooling.
- Enterprise Storage Area Networks (SAN): Deployed in high-density Fibre Channel director modules, SAN storage expansion chassis, and storage array controllers.
- Carrier-Grade Telecom Infrastructure: Suitable for deployment in 5G mobile backhaul aggregation routers, Optical Transport Networks (OTN), and unconditioned edge compute enclosures.
Technical Specifications
| Part Number | 2342933-2 | Part Status | Active |
| Connector Style | Cage with Heat Sink | Connector Type | QSFP-DD (Double Density) |
| Heat Sink Style | SAN | Mounting Type | Through Hole, Right Angle |
| Termination | Press-Fit | Features | EMI Shielded |
| Port Matrix Configuration | 1x1 Ports | Number of Ports | 1 |
| Number of Rear EONs per Port Column | 1 | Heat Sink Height | 6.5mm[.256in] |
| Operating Temperature Range | - | Heat Sink Style | Networking |
| Circuit Application | Signal | Cage Material | Stainless Steel |
| Included Lightpipe | NO |
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Important Notice
Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by F-tone Networks before they become applicable to any particular order or contract. In accordance with the F-tone Networks policy of continuous improvement specifications may change without notice.
The publication of information in this data sheet does not imply freedom from patent or other protective rights of F-tone Networks or others. Further details are available from any F-tone Networks sales representative.
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Power and Wavelength Testing
Test the signal delivering strength and wavelength, to ensure the signal decoding capacity of the receiver, and the wavelength remains consistent from the transmitter to the receiver.
Traffic Testing
Test the bit error rate and packet loss rate, to make them meet the corresponding standards and ensure the performance of transceivers.
Optical Performance Testing
Test the transceivers' eye diagram situation, receiving sensitivity, extinction ratio, wavelength, light-emitting, light-receiving, current and voltage, to ensure the signal quality, stability and reliability of the transmission.
End Face Testing
Check the end face of the transceivers and keep them clean for more stable data transmission, better performance, and durability.
Various Switch Tests
Every module is quality tested for compatibility in the multi-brand switches environment, guaranteeing flawless operations.